Conformal Power Delivery Structure for Low-IR-Drop Chip Attach
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current DCA architectures face challenges with high IR drop in redistribution layers (RDL) due to limited metal availability for power delivery, leading to inefficiencies in power distribution and increased resistance.
Innovation Solution
Incorporating conformal power delivery structures into the base die, which feature bi-directional resistance of 5 mΩ, allowing for a more efficient power distribution comparable to traditional package power plane solutions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If RDL layers are used for power delivery routing in current DCA architectures, then power delivery is enabled, but IR drop becomes quite high and few traces are left for JO or other types of routing
Solution Approach 1:
The invention segments the power delivery function by introducing a dedicated conformal power delivery structure separate from the RDL layers. The conformal structure includes multiple power planes (first power plane, second power plane, third power plane) that are specifically designed for power delivery, while the RDL layers can be dedicated to signal routing. This segmentation allows power delivery and signal routing to occur in separate structural domains, eliminating the trade-off between power delivery capability and available routing traces.
Solution Approach 2:
The conformal power delivery structure acts as an intermediary between the RDL layers and the substrate. It provides a low-resistance path for power delivery through its bi-directional resistance of 5 mΩ, which is lower than traditional RDL-based power delivery. The structure includes conductive via holes that connect the power planes to the substrate, creating an efficient power delivery pathway that does not compete with RDL routing resources.
2Power
If most of the RDL routing is used for power delivery, then power distribution is enabled, but few traces are left for JO or other types of routing
Solution Approach 1:
The invention segments the routing functions by creating separate structural domains: the conformal power delivery structure handles power distribution, while the RDL layers are freed for JO and other signal routing. The conformal structure includes first, second, and third power planes that provide comprehensive power distribution coverage, while signal routing occurs in the RDL layers above and below the conformal structure, eliminating resource competition.
Solution Approach 2:
The invention moves power delivery to a different dimensional domain by implementing conformal power planes that wrap around the RDL structure. The first power plane is above the RDL, the second power plane is below the RDL, and the third power plane is on the substrate, creating a three-dimensional power delivery network that does not occupy the two-dimensional RDL routing space, thereby preserving routing versatility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conformal power delivery structures significantly reduce IR drop, enabling more efficient power delivery and allowing a larger portion of RDL lines to be used for routing low-current supplies and IO signals.
Implementation Method 1
a first electrically conductive layer comprising metal, the first electrically conductive layer defining one or more recesses; a second electrically conductive layer comprising metal, the second electrically conductive layer at least partially within the recesses of the first electrically conductive layer
Data Source
AI summary
In one embodiment, a base die apparatus includes a conformal power delivery structure comprising a first electrically conductive layer defining one or more recesses, and a second electrically conductive layer at least partially within the recesses of the first electrically conductive layer and having a lower surface that generally conforms with the upper surface of the first electrically conductive layer. The conformal power delivery structure also includes a dielectric material between the surfaces of the first electrically conductive layer and the second electrically conductive layer that conform with one another. The conformal power delivery structure may be connected to connection pads of the base die apparatus, e.g., to provide power delivery to integrated circuit (IC) chips connected to the base die apparatus. The base die apparatus also includes bridge circuitry to connect IC chips with one another.