Conformal Protective Film Formation on Electronic Modules
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Solution Overview
Problem
Traditional methods for forming protective films on electronic modules result in residual bubbles and water vapor coating due to inadequate adhesion, compromising the reliability and lifespan of electronic components.
Innovation Solution
A method involving a chamber with a boost unit, pumping unit, and heating unit to soften and then pressurize a protective material with high-pressure gas, ensuring conformal coverage and solidification over electronic modules without mechanical pressure, thereby eliminating gas gaps and enhancing adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional mechanical or manual methods are used to attach protective adhesive to the motherboard, then the process is simple and easy to operate, but residual bubbles remain between the protective adhesive and the motherboard or electronic components, compromising reliability
Solution Approach 1:
The patent replaces traditional mechanical attachment methods with a vacuum-based system. A vacuum chamber is used to remove air bubbles, and vacuum pressure is applied to ensure conformal contact between the protective film and electronic components, eliminating the need for manual pressing and achieving bubble-free adhesion without complex mechanical pressure application tools
Solution Approach 2:
The patent uses a vacuum environment (inert atmosphere free of air) to prevent air bubbles from forming between the protective film and electronic components. By creating a vacuum chamber, all air is evacuated before the protective film is applied, ensuring complete contact and eliminating the reliability issues caused by trapped air pockets
2Duration of action of stationary object
If traditional methods are used to apply protective adhesive, then the process is simple, but water vapor coating occurs which reduces the life of electronic components
Solution Approach 1:
The vacuum chamber creates an inert environment free of water vapor and other contaminants. By maintaining vacuum conditions throughout the protective film application and curing process, the patent prevents water vapor coating on electronic components, thereby extending their operational life without requiring additional protective measures
Solution Approach 2:
The patent utilizes phase transition of materials under vacuum conditions. The protective adhesive undergoes controlled curing (phase change from liquid to solid) in the vacuum environment, ensuring proper adhesion while the vacuum prevents water vapor condensation that would otherwise occur at lower temperatures or during cooling phases
3Manufacturing precision
If protective adhesive is applied without vacuum pressurization, then the process is simple and fast, but the protective adhesive does not adhere tightly and residual bubbles are present
Solution Approach 1:
The patent replaces complex mechanical pressurization systems with a simple vacuum chamber. By evacuating the chamber and applying vacuum pressure, the protective film is automatically pressed conformally against all surfaces without requiring mechanical rollers, presses, or manual manipulation, achieving high precision with minimal time
Solution Approach 2:
The vacuum system performs multiple functions simultaneously: it removes air bubbles, presses the protective film conformally against the components, and maintains a clean environment. The system is self-regulating, automatically achieving the desired conformal contact without requiring operator intervention or complex control mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves a high-quality, conformal protective film that prevents damage and ensures good performance by eliminating residual bubbles and water vapor issues, ensuring reliable and long-lasting electronic components.
Implementation Method 1
a first heating process is performed on the protective material in the chamber to soften the protective material disposed on the electronic modules
Implementation Method 2
The protective material conformally covering the top of the electronic modules is solidified to form the protective film conformally covering the top of the electronic modules
Implementation Method 3
a gas decompression process is performed on the chamber... a boost process is performed on the chamber, wherein in the boost process, a gas in the chamber directly pressurizes the protective material such that the protective material conformally covers a top of the electronic modules
Data Source
AI summary
A method of forming a protective film on at least one electronic module is provided. The method includes the following steps. A protective material is disposed on at least one electronic module such that the protective material and the electronic modules are in contact with each other. The electronic modules and the protective material disposed on the electronic modules are disposed in a chamber, and a first ambient pressure is provided in the chamber. The protective material in the chamber is heated to a first temperature to soften the protective material disposed on the electronic modules. After the protective material is softened, a second ambient pressure greater than the first ambient pressure is provided in the chamber, wherein a gas in the chamber directly pressurizes the protective material such that the protective material conformally covers a top of the electronic modules. The protective material conformally covering the top of the electronic modules is heated to a second temperature to solidify the protective material conformally covering the top of the electronic modules to form a protective film conformally covering the top of the electronic modules.