Conformal Shield Compartmentalization for Semiconductor Package Isolation
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Solution Overview
Problem
Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to suboptimal performance.
Innovation Solution
The semiconductor device design includes a substrate with electronic components, an encapsulant, and a conformal shield, where the conformal shield defines compartments to isolate electronic components, providing protection and electrical connectivity while allowing unshielded communication for one component and shielding another, optimizing package size and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packages are used, then manufacturing is simpler, but package size is too large and cost is excessive
Solution Approach 1:
The package structure is segmented into distinct compartments (shielded and unshielded) using partition walls and conformal shields. This segmentation allows different electronic components to be isolated in specific zones, enabling compact integration while maintaining functional separation, thus reducing overall package size without excessive complexity
Solution Approach 2:
The patent utilizes three-dimensional packaging arrangements with vertical stacking and multi-layer interconnect structures. By transitioning from planar two-dimensional layouts to three-dimensional configurations, the design achieves higher component density and smaller package footprint while managing complexity through systematic layering
2Reliability
If conventional semiconductor packages are used, then manufacturing process is less complex, but reliability is decreased
Solution Approach 1:
Different regions of the package are assigned different shielding properties - some compartments have conformal shields for EMI/RFI protection while others remain unshielded for wireless communication. This local differentiation of quality ensures that each component receives appropriate protection, improving overall reliability without requiring complete shielding of the entire package
Solution Approach 2:
Partition walls and conformal shields serve as intermediary structures that isolate electromagnetic signals between different compartments. These intermediaries prevent signal interference and crosstalk, enhancing reliability by ensuring stable operation of sensitive components without requiring overly complex shielding arrangements
3Productivity
If conventional semiconductor packages are used, then manufacturing is simpler, but performance is relatively low
Solution Approach 1:
The package is divided into functionally segregated compartments that optimize performance - shielded compartments for sensitive analog/RF components and unshielded compartments for wireless communication elements. This segmentation enables each component to operate at optimal performance levels without interference, achieving high overall device performance
Solution Approach 2:
The conformal shields are designed with selective conductivity - providing electromagnetic shielding in certain frequency ranges while maintaining signal transparency in others. This dynamic response to different signal types allows the structure to simultaneously protect sensitive components and enable wireless communication, enhancing performance without proportional increase in complexity
Data Source
AI summary
In one example, a semiconductor device comprises a substrate, a first electronic component on a top side of the substrate, a second electronic component on the top side of the substrate, an encapsulant on the top side of the substrate, contacting a lateral side of the first electronic component and a lateral side of the second electronic component, a conformal shield on a top side of the encapsulant over the first electronic component and having a side shield contacting a lateral side of the encapsulant, and a compartment wall between the first electronic component and the second electronic component and contacting the conformal shield to define a compartment containing the first electronic component and excluding the second electronic component. Other examples and related methods are also disclosed herein.