Conductive Conformal Shield for IC Packaging EMI
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Solution Overview
Problem
Integrated circuit packaging systems face challenges in reducing package size while maintaining electromagnetic interference shielding, manufacturing yield, and long-term reliability, as existing solutions increase costs and compromise reliability.
Innovation Solution
A method involving a substrate with internal circuitry and a conductive conformal shield structure applied directly on the molded package body and vertical sides, extending below the substrate bottom side to couple with internal circuitry, providing effective electromagnetic shielding without compromising package size or reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If components are mounted extremely close together to reduce package size, then package size is reduced, but electromagnetic interference increases and reliability deteriorates
Solution Approach 1:
A conductive shield structure is introduced as an intermediary element between closely mounted components. The shield includes a conductive conformal coating applied to the package body and conductive elements on the substrate, creating a protective barrier that blocks electromagnetic interference while allowing the components to remain in close proximity for miniaturization.
Solution Approach 2:
The conductive conformal coating is applied as a thin film structure that conforms to the package body geometry. This thin conductive layer provides electromagnetic shielding without adding significant volume, enabling compact packaging while maintaining reliability through interference protection.
2Object-affected harmful factors
If electro-magnetic shielding is added to components, then electromagnetic interference protection is improved, but manufacturing cost increases and yield decreases
Solution Approach 1:
The electromagnetic shielding structure is merged with the package body itself. The conductive conformal coating is applied directly to the molded package body, and conductive elements are integrated into the substrate structure. This integration eliminates the need for separate shielding components and reduces manufacturing complexity.
Solution Approach 2:
The package body serves multiple functions: it provides structural support, houses the components, and simultaneously acts as the substrate for the conductive shielding coating. The substrate also serves as both the mounting platform and as part of the shielding structure through its conductive elements, reducing the total number of components and manufacturing steps.
3Ease of manufacture
If manufacturers compromise on shielding quality to reduce costs, then manufacturing cost is reduced, but long term reliability deteriorates
Solution Approach 1:
The conductive conformal coating is applied to the package body during the molding process itself, before final assembly. The conductive elements are pre-formed on the substrate before component mounting. This preliminary integration of shielding structures into the base manufacturing process eliminates the need for separate, costly shielding assembly steps while ensuring consistent quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables a thin, reliable, and manufacturable integrated circuit package that effectively shields against electromagnetic interference, maintaining electrical integrity and reducing manufacturing costs while supporting increased functionality in smaller form factors.
Implementation Method 1
applying a conductive conformal shield structure directly on the molded package body, the vertical sides, and extending below the substrate bottom side for coupling the internal circuitry
Data Source
AI summary
An integrated circuit packaging system and method of manufacture thereof includes: a substrate with internal circuitry between a substrate top side, a substrate bottom side, and vertical sides; an integrated circuit coupled to the internal circuitry; a molded package body formed directly on the integrated circuit and the substrate top side of the substrate; and a conductive conformal shield structure applied directly on the molded package body, the vertical sides, and to extend below the substrate bottom side coupled to the internal circuitry.