3D Printed Conformal Shielding for Semiconductor Package EMI
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Solution Overview
Problem
Semiconductor packages face challenges in miniaturization and weight reduction while maintaining effective electromagnetic interference (EMI) shielding, as existing solutions often result in inefficient integration due to high aspect ratios and material thickness limitations.
Innovation Solution
A semiconductor package design incorporating a shielding layer with a unique geometry and a thixotropic or hot melt insulating layer, formed using 3D printing, which reduces the thickness of the shielding and insulating layers to achieve a higher aspect ratio, thereby minimizing EMI and enabling miniaturization and weight reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional shielding structures are used, then EMI shielding is provided, but the package size and weight increase
Solution Approach 1:
The patent employs a thin film shielding layer made of conductive material that conformally coats the semiconductor chip surfaces. This thin film approach provides effective EMI shielding while minimizing the added weight and volume compared to conventional bulk shielding structures.
Solution Approach 2:
The shielding layer is integrated directly onto the chip surfaces through conformal coating, nesting the shielding function within the existing package structure rather than adding separate external shielding components. This integration reduces overall package size and weight.
2Object-affected harmful factors
If conventional shielding structures are used, then EMI shielding is provided, but the package volume increases
Solution Approach 1:
The shielding is implemented as a thin conformal film rather than a thick discrete structure, providing EMI protection with minimal volume addition. The film follows the chip contours, maximizing shielding effectiveness per unit volume.
Solution Approach 2:
The shielding approach transitions from three-dimensional bulk shielding structures to two-dimensional surface coatings, reducing the volume occupied by shielding materials while maintaining shielding effectiveness through surface coverage.
3Object-affected harmful factors
If thicker shielding layers are used, then EMI shielding effectiveness is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs conformal coating processes that precisely control film thickness through process parameters rather than relying on thick discrete components. The coating methodology inherently provides uniform thickness control at the micro-scale, achieving both thin profile and manufacturing precision.
Solution Approach 2:
The thin film shielding layer is deposited using conformal coating techniques that provide inherent thickness uniformity and precise control, eliminating the need for post-manufacturing adjustments and reducing overall manufacturing complexity despite the thin dimensions.
4Volume of moving object
If miniaturization is pursued, then package size is reduced, but EMI shielding effectiveness deteriorates
Solution Approach 1:
The conformal thin film shielding provides effective EMI protection in miniaturized packages by coating all relevant chip surfaces, ensuring that shielding effectiveness is maintained through complete surface coverage rather than relying on component size.
Solution Approach 2:
The patent addresses miniaturization by transitioning to surface-level shielding (2D) rather than volumetric shielding (3D), allowing effective EMI protection to be achieved within the limited volume of miniaturized packages through optimized surface coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces EMI, allows for higher integration density, and miniaturizes semiconductor packages, enhancing their performance and reliability in portable devices.
Implementation Method 1
the insulating layer may be formed by using a thixotropic material, and the thixotropic material may change its viscosity according to shear stress applied thereto
Implementation Method 2
the insulating layer and the shielding layer may be formed by using a three-dimensional (3D) printer
Data Source
AI summary
A semiconductor package includes a semiconductor chip mounted on a substrate, an insulating layer covering at least a portion of the semiconductor chip and including a thixotropic material or a hot melt material, and a shielding layer covering at least a portion of the semiconductor chip and the insulating layer. A method of manufacturing the semiconductor package includes forming an insulating layer and a shielding layer having a high aspect ratio by using a three-dimensional printer.