Conforming Heat Transport Device for Dense DIMM Cooling
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Solution Overview
Problem
High heat density in computer systems with densely packed electronic components, particularly in high-density memory modules, necessitates more effective cooling methods beyond conventional convection, especially in sealed environments where air circulation is limited.
Innovation Solution
A cooling system utilizing a rigid heat spreader device thermally coupled with circuit boards, combined with conforming heat transfer devices and heat transport devices to enhance thermal conduction and convection, including the use of pliant gap-filler materials and elastic tabs to ensure comprehensive thermal contact and efficient heat distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional convection cooling is used, then the cooling system is simple, but it is ineffective in high-density systems with limited air circulation
Solution Approach 1:
The patent introduces a heat spreader as an intermediary component between the memory module and the cooling system. The heat spreader conducts heat away from the memory module and distributes it over a larger area, enabling effective heat removal in high-density systems where conventional convection is insufficient.
Solution Approach 2:
The patent employs liquid cooling through a heat transport device that carries coolant to remove heat from the heat spreader. This hydraulic approach provides superior cooling capability compared to air convection, addressing the limitation of limited air circulation in sealed environments.
2Reliability
If heat spreader is tightly coupled to memory module, then thermal contact is improved, but surface contour mismatches reduce contact effectiveness
Solution Approach 1:
The patent changes the physical state of the heat transfer device from rigid to compliant, allowing it to deform and adapt to the surface contour of the heat spreader. This compliance ensures maximum thermal contact area despite surface irregularities or contour mismatches.
Solution Approach 2:
The heat transfer device is designed as a flexible, compliant component that can conform to the heat spreader's surface. This flexibility allows the device to maintain intimate thermal contact across the entire interface, overcoming surface contour challenges.
3Reliability
If heat transfer device is made compliant, then surface contact is maximized, but thermal conductivity may be reduced
Solution Approach 1:
The patent employs a composite structure where a compliant substrate provides surface conformity while embedded high-thermal-conductivity pathways or particles maintain effective heat transfer. This composite approach balances the need for flexibility with the requirement for thermal conductivity.
Solution Approach 2:
The heat transfer device incorporates regions of different properties: compliant regions for surface contact and high-conductivity regions for heat transport. This local differentiation allows the device to simultaneously achieve maximum contact area and maintain thermal conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces heat density by maximizing thermal conductivity and convection, ensuring targeted cooling of hot spots in high-density memory modules, thereby enhancing system performance and longevity.
Implementation Method 1
a rigid heat spreader device to be thermally coupled with a circuit board, to be cooled
Implementation Method 2
a conforming heat transfer device to conduct heat away from the heat spreader
Implementation Method 3
combined with conforming heat transfer devices and heat transport devices to enhance thermal conduction and convection
Implementation Method 4
heat transport devices to enhance thermal conduction and convection
Data Source
AI summary
A circuit board cooling apparatus is disclosed having a heat spreader device to be thermally coupled with a surface of the circuit board to be cooled. Also, a conforming heat transfer device is disclosed that is thermally and physically coupled with the heat spreader device to conform to a surface contour of the heat spreader device on a first side of the heat transfer device. The cooling apparatus also includes a heat transport device physically attached and thermally coupled with a second side of the heat transfer device.