Dynamically Conforming Workpress for Multi-Planar Chip Package Testing
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Solution Overview
Problem
Conventional automated test systems for chip packages face challenges in uniformly applying force due to non-uniform topography, leading to potential damage and poor testing results, especially in lid-less designs with varying dice heights.
Innovation Solution
A dynamically conforming workpress with individual pusher pins that adapt to the multi-planar topography of chip packages, allowing localized force application to ensure robust electrical connections without damaging the components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If a conventional rigid workpress is used to apply force to the chip package, then the testing process can be automated, but the force is applied non-uniformly due to height differences in chip components, causing damage or poor electrical connection
Solution Approach 1:
The workpress is segmented into multiple independent pusher pins instead of a single rigid surface. Each pusher pin can move independently and apply force to specific contact points on the chip package, allowing uniform force distribution across components of varying heights while maintaining automated operation
Solution Approach 2:
The pusher pins are made dynamically adjustable with individual position and force control. This allows the workpress to adapt to the multi-planar topography of different chip packages by dynamically positioning each pin to contact surfaces at different heights, ensuring reliable electrical connection without damage
2Strength
If a rigid aluminum workpress surface is used, then the structure is simple and strong, but it cannot adapt to varying chip package topographies, resulting in non-uniform force application
Solution Approach 1:
The rigid workpress surface is segmented into multiple independent pusher pins that can move individually. This segmentation maintains the overall structural strength of the workpress while enabling each pin to adapt to different heights and contours of chip components, solving the contradiction between strength and adaptability
Solution Approach 2:
The position and force parameters of each pusher pin are made independently adjustable. This allows the system to change parameters dynamically to match the specific topography of different chip packages, providing adaptability without compromising the structural integrity of the workpress
3Ease of manufacture
If uniform force is applied across the chip package surface, then the application is simple, but height differences cause some regions to receive excessive force while others receive insufficient force
Solution Approach 1:
The uniform force application is segmented into multiple localized force applications through individual pusher pins. Each pin applies force independently to its contact point, ensuring that force is distributed uniformly across the chip package surface despite height variations, maintaining simplicity while improving reliability
Solution Approach 2:
Each pusher pin provides localized force application tailored to the specific topography at its contact point. This local quality approach ensures that each region of the chip package receives the appropriate amount of force needed for reliable electrical connection without causing damage, overcoming the limitations of uniform force application
Data Source
AI summary
An integrated chip package assembly test system and method for testing a chip package assembly are described herein. In one example, an integrated circuit chip package test system includes a socket and a workpress. The socket is configured to receive a chip package assembly for testing in the test system. The workpress is positioned over the socket and has a bottom surface that is dynamically conformable to a multi-planar top surface topography of the chip package assembly.