Conical Heat-Pipe Cooling for Plasma Reactor Dielectric Windows
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current cooling methods for dielectric windows in inductive plasma-based reactors face challenges due to non-uniform thermal distribution and mechanical stress, leading to increased particulate contamination and potential delamination, with existing solutions like forced air and cooling liquid channels being inefficient and complex.
Innovation Solution
A heat-pipe cooling system using a closed-cycle thermosyphon with a conical structure and embedded RF coils, employing a dielectric heat-transfer fluid that evaporates on the window surface and condenses elsewhere, providing a passive and uniform temperature control mechanism.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If forced air cooling is used for the dielectric window, then cooling capability is provided, but system complexity increases and thermal uniformity deteriorates
Solution Approach 1:
The dielectric window itself serves as the cooling structure by incorporating cooling channels directly within it. The window's own structure is utilized to conduct and distribute coolant, eliminating the need for separate cooling systems and achieving self-cooling functionality.
Solution Approach 2:
The cooling function is merged with the dielectric window structure by integrating cooling channels within the window body. This combines the structural and cooling functions into a single integrated component, reducing overall system complexity while improving thermal management effectiveness.
2Temperature
If cooling liquid channels are embedded in the dielectric window, then cooling efficiency improves, but manufacturing difficulty increases and window strength decreases
Solution Approach 1:
The cooling channels are formed by changing the physical state of material during manufacturing - using a sacrificial material that is deposited, cured, and then removed through etching or dissolution. This parameter change approach enables complex internal channel geometries to be created within the dielectric window.
Solution Approach 2:
The cooling channels are strategically positioned in specific regions of the dielectric window where heat generation and accumulation occur. The channel distribution and geometry are optimized for local thermal conditions, providing enhanced cooling where needed while maintaining overall window integrity and manufacturability.
3Productivity
If high RF power is applied to the plasma reactor, then processing productivity increases, but thermal stress on the dielectric window increases
Solution Approach 1:
Coolant acts as an intermediary substance that absorbs thermal energy from the dielectric window through the embedded cooling channels. This intermediary heat transfer mechanism allows high RF power to be applied to the plasma while the coolant continuously removes generated heat, preventing excessive thermal stress accumulation in the window.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat-pipe cooling system achieves a more uniform temperature distribution across the dielectric window, reducing thermal stress and particulate contamination, while being feasible for implementation in ICP/TCP reactors without the need for complex refurbishments.
Implementation Method 1
A heat-pipe cooling system uses a closed-cycle thermosyphon with a conical structure disposed above a dielectric window... employing a dielectric heat-transfer fluid that evaporates on the window surface
Implementation Method 2
A heat-pipe cooling system uses a closed-cycle thermosyphon with a conical structure disposed above a dielectric window... providing a passive and uniform temperature control mechanism
Implementation Method 3
A heat-pipe cooling system uses a closed-cycle thermosyphon with a conical structure disposed above a dielectric window... that evaporates on the window surface and condenses elsewhere
Implementation Method 4
A heat-pipe cooling system uses a closed-cycle thermosyphon with a conical structure disposed above a dielectric window
Implementation Method 5
A heat-pipe cooling system uses a closed-cycle thermosyphon... providing a passive and uniform temperature control mechanism
Data Source
AI summary
In one embodiment, the disclosed apparatus is a heat-pipe cooling system that includes a conical structure having an upper portion that is configured to be formed above a dielectric window with the conical structure being configured to condense vapor from a heat-transfer fluid placed or incorporated within a volume formed between the dielectric window and the conical structure. At least one cooling coil is formed on an exterior portion of the conical structure. Other apparatuses and systems are disclosed.