Conical Transformer Cooling Plate for Data Center Heat Dissipation
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Solution Overview
Problem
High-performance information processing apparatuses, such as data center servers and supercomputers, face challenges in cooling large heat-generating components like transformers, where traditional water cooling methods are inefficient due to low thermal conductivity of magnetic substances, leading to temperature limitations and reduced performance.
Innovation Solution
A cooling apparatus featuring a transformer unit with a potting material and a conical component case that fits into a conical hole in a cooling plate, allowing for efficient heat transfer from the transformer's side and upper portions to a cooling plate, which then dissipates heat via coolant to a heat dissipation unit, reducing thermal resistance and preventing temperature exceedance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling plate is attached to a transformer, then heat dissipation is improved, but the thermal conductivity of magnetic substances limits cooling efficiency
Solution Approach 1:
The patent introduces a heat dissipation unit with high thermal conductivity material as an intermediary between the transformer and the cooling plate. This intermediary component overcomes the low thermal conductivity of the transformer's magnetic substance, enabling efficient heat transfer from the transformer windings to the cooling water without being limited by the magnetic material's thermal properties.
2Ease of manufacture
If the cooling plate is positioned far from the heat generating component, then assembly is easier, but heat dissipation efficiency decreases
Solution Approach 1:
The patent extends the cooling function from a single-plane cooling plate to a three-dimensional heat dissipation unit that wraps around the transformer. This dimensional extension allows the cooling surface to approach the heat-generating windings from multiple directions, achieving excellent heat dissipation efficiency while maintaining reasonable assembly ease through modular construction.
3Device complexity
If a conventional cooling plate design is used, then manufacturing is simpler, but positional deviations during rotation occur
Solution Approach 1:
The patent employs asymmetric positioning structures including protrusions and recesses, as well as conical configurations, to eliminate rotational ambiguity. These asymmetric features ensure that the heat dissipation unit maintains a fixed angular position relative to the transformer, preventing positional deviations during rotation while adding only minimal structural complexity.
4Temperature
If the cooling apparatus is made larger to improve cooling, then heat dissipation is better, but the size of the information processing apparatus increases
Solution Approach 1:
The patent implements a nested configuration where the heat dissipation unit is integrated around the transformer, and the cooling plate is positioned within the apparatus housing. This nesting approach allows the cooling components to occupy space that would otherwise be empty, achieving effective cooling without increasing the overall apparatus footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively cools the entire transformer, preventing temperature exceedance and allowing for full performance without current limitations, while also reducing the size of the information processing apparatus by minimizing the distance to the cooling plate and avoiding positional deviations during rotation.
Implementation Method 1
The heat generated from the heat generating component is transported to the heat dissipation unit by the cooling water passing through the cooling plate, and dissipated from the heat dissipation unit to the atmosphere.
Implementation Method 2
The cooling plate is formed of a metal having high thermal conductivity, and a flow path, through which the cooling water flows, is formed inside the cooling plate.
Data Source
AI summary
A cooling apparatus includes an assembly including an electronic device and a potting material that covers a side portion and an upper portion of the electronic device, the assembly having a conical upper portion, and a cooling plate including a conical hole, into which the upper portion of the assembly is fitted, and a flow path, through which a coolant flows.