Connect Die 3D Stacked Semiconductor Package Routing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packages face issues of high cost, decreased reliability, and large package sizes, which hinder efficient manufacturing and performance.
Innovation Solution
A semiconductor package structure and method that involves connecting multiple semiconductor dies through a connect die with advanced interconnection structures, such as metal pillars or conductive bumps, to enhance routing density and reliability, while using a carrier and encapsulating process to optimize packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packages are used, then manufacturing cost is reduced, but reliability decreases and package size increases
Solution Approach 1:
The patent transitions from planar 2D packaging to 3D vertical stacking by introducing through-silicon vias (TSVs) and multi-layer interconnection structures. Semiconductor dies are stacked vertically with interconnect structures extending through the thickness direction, enabling three-dimensional signal routing that increases integration density while reducing the lateral package footprint.
Solution Approach 2:
The patent implements nested interconnection structures where conductive layers, dielectric layers, and TSVs are arranged in multiple stacked layers. Each layer contains interconnect elements that are vertically aligned and electrically connected through subsequent layers, creating a nested hierarchical structure that maximizes routing capacity within a compact volume.
2Quantity of substance
If conventional interconnection structures are used, then manufacturing complexity is reduced, but routing density decreases
Solution Approach 1:
The interconnection structure is segmented into multiple functional layers: bottom electrode layers, dielectric layers, top electrode layers, and TSV structures. Each layer performs a specific function in the signal routing path, allowing independent optimization of each segment while achieving high overall routing density through the vertical stack.
Solution Approach 2:
The patent adds the vertical dimension to interconnection routing by implementing TSVs that penetrate through the substrate thickness. This transforms two-dimensional planar routing into three-dimensional vertical routing, dramatically increasing the number of available signal paths without increasing lateral footprint.
3Quantity of substance
If advanced interconnection structures are implemented, then routing density increases, but manufacturing cost increases
Solution Approach 1:
The interconnection structures serve multiple functions: electrical signal routing, mechanical support, and thermal management. The TSVs and multi-layer electrodes provide both electrical connectivity and structural integrity, while the dielectric layers provide both insulation and mechanical support, reducing the need for separate dedicated components.
Solution Approach 2:
The patent forms interconnection structures, TSVs, and dielectric layers in a predetermined stacked sequence during the manufacturing process. By pre-configuring the vertical stack architecture before die attachment, the structure is prepared in advance for subsequent assembly steps, streamlining the overall manufacturing workflow.
4Reliability
If multiple semiconductor dies are connected through connect die, then reliability increases, but device complexity increases
Solution Approach 1:
The patent merges multiple semiconductor dies vertically into a single integrated stack, with connect dies positioned between functional dies to establish electrical connections. The multi-layer interconnection structures combine routing, support, and insulation functions into unified vertical assemblies, reducing the overall system complexity despite increased integration.
Solution Approach 2:
Connect dies serve as intermediary components that facilitate electrical signal routing between adjacent functional semiconductor dies in the vertical stack. These intermediary elements provide standardized interface structures that simplify the connection process and improve signal integrity between dies from different fabrication processes.
Data Source
AI summary
A semiconductor package structure and a method for making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a connect die that routes electrical signals between a plurality of other semiconductor die.