Connecting Device Segmentation for Flat Panel Recycling

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Solution Overview

Problem

The existing connecting methods for chip units and substrate units, such as in X-ray flat panel detectors and other flat panel devices, result in significant waste due to damage of flexible connecting devices during separation, leading to inefficient recycling and high waste rates.

Innovation Solution

A connecting device comprising a first flexible connection unit and a rigid connection unit, where the chip unit is electrically connected to the substrate unit via a sequence of wires, utilizing anisotropic conductive film bonding or metal-welding, allowing for sequential signal transmission and reducing damage during separation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If chip units and substrate units are connected using flexible connecting devices with anisotropic conductive film bonding or metal-welding, then electrical connection and signal transmission are achieved, but the flexible connecting devices are damaged during separation leading to high waste rates

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidwaste rate of flexible connecting devices
Core Design Contradiction:
ReliabilityVSLoss of substance

Solution Approach 1:

The patent divides the connection system into separate components: a rigid connection unit with conductive patterns and flexible connection units that can be independently separated. The rigid connection unit remains on the substrate while flexible connection units can be detached without damage, enabling recycling and reducing waste.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a rigid connection unit as an intermediary between the substrate and flexible connection units. This rigid unit with conductive patterns serves as a stable interface that allows flexible units to be connected and disconnected without damaging the flexible materials themselves.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If sequential signal transmission is implemented through multiple connection units, then signal transmission efficiency is improved, but device complexity increases

Engineering Contradiction:
Improvesignal transmission efficiencyVSAvoidconnection unit structure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The signal transmission path is segmented into multiple independent connection units (first flexible connection unit, rigid connection unit, second flexible connection unit) that can be separately manufactured and assembled. Each unit has a specific function, allowing modular design that simplifies overall system complexity while enabling sequential signal transmission.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The rigid connection unit with its conductive patterns serves multiple functions: it provides electrical connection, structural support, and a standardized interface for connecting flexible units. This multi-functionality reduces the need for separate components, thereby managing complexity while maintaining transmission efficiency.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables efficient electrical connection and sequential signal transmission while minimizing damage and waste, facilitating recycling and improving the reliability of flat panel devices.

Implementation Method 1

a first conductive contact terminal and a second conductive contact terminal are disposed on two ends of the first wire of the first flexible connection unit, respectively; a third conductive contact terminal is disposed on one end of the second wire of the rigid connection unit; the first conductive contact terminal is used for connecting to the substrate unit by anisotropic conductive film bonding or metal-welding; and the second conductive contact terminal and the third conductive contact terminal are connected by anisotropic conductive film bonding or metal-welding

Methodology Applied
Scientific EffectAnisotropic conductive film bonding: Conduction (electrical)

Implementation Method 2

the first conductive contact terminal is used for connecting to the substrate unit by anisotropic conductive film bonding or metal-welding; and the second conductive contact terminal and the third conductive contact terminal are connected by anisotropic conductive film bonding or metal-welding

Methodology Applied
Scientific EffectMetal-welding: Welding

Data Source

PatentEP2840656B1Connecting device, flat panel device, image sensor, display and touch device
Publication Date: 2018.08.08 SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
  • EP2840656B1 patent drawingFigure 1~2
  • EP2840656B1 patent drawingFigure 3~4
  • EP2840656B1 patent drawingFigure 5~6

AI summary

The present invention discloses, a connecting device, a flat panel device, an image sensor, a display and a touch apparatus are described. The connecting device for connecting a substrate unit and a chip unit, provided by the present invention, comprises a first flexible connection unit, including a first wire for electrically connecting to the substrate unit; a rigid connection unit, connected to the first flexible connection unit and including a second wire for electrically connecting to the first wire; the chip unit is electrically connected to the second wire. In the present invention, the chip unit is electrically connected to the substrate unit via the rigid connection unit and the flexible connection unit in sequence.