Connecting Material for Semiconductor Devices
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Solution Overview
Problem
Conventional connecting materials fail to adequately suppress cracking during stress loads and ensure uniform thickness in connection parts, which affects heat dissipation performance and connection strength in semiconductor devices.
Innovation Solution
A connecting material comprising particles with specific properties, including a 10% K value between 3000 N/mm² and 20000 N/mm², a particle diameter CV value of 10% or less, and an average diameter of 1 μm to 300 μm, used to form a connection part that maintains twice or less the initial particle diameter, with a thermal decomposition temperature of 200°C or more, and containing metal atom-containing particles for enhanced strength and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional connecting materials are used, then connection is achieved, but cracking occurs during stress load
Solution Approach 1:
The patent changes the physical and chemical parameters of the connecting material by using metal particles with specific properties: average particle diameter of 100 nm or less, surface coating with organic substance, and controlled composition. These parameter changes enable the material to achieve both high connection strength and crack resistance during stress load
Solution Approach 2:
The patent employs composite material structure consisting of metal particles (such as Ag, Cu, Al, or their alloys) coated with organic substances. This composite structure combines the high strength and thermal conductivity of metal particles with the stress-absorbing and crack-resistant properties of the organic coating, resolving the contradiction between connection strength and crack resistance
2Manufacturing precision
If conventional connecting materials are used, then connection is formed, but variation in thickness is large
Solution Approach 1:
The patent controls the thickness uniformity by precisely controlling the particle size parameter (average diameter ≤100 nm) and the organic coating thickness. This parameter control ensures that the connection part thickness variation is kept within ±1 μm, achieving high manufacturing precision while maintaining ease of manufacture
Solution Approach 2:
The patent performs preliminary action by pre-coating the metal particles with organic substances before connection. This pre-coating ensures uniform particle properties and predictable connection behavior, allowing accurate control of the distance between members and uniform thickness of the connection part
3Temperature
If metal particles with small diameter are used, then sintering temperature decreases, but connection reliability may be compromised
Solution Approach 1:
The patent uses composite material consisting of ultrafine metal particles (≤100 nm) coated with organic substances. The organic coating protects the small metal particles from oxidation and aggregation during heating, while the small particle size enables low-temperature sintering. This composite structure maintains connection reliability even with reduced sintering temperature
Solution Approach 2:
The patent changes the particle size parameter to 100 nm or less, which fundamentally alters the sintering behavior. At this scale, the surface area to volume ratio increases dramatically, enabling sintering at much lower temperatures while maintaining connection reliability through the protective organic coating
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses cracking and variation in thickness, ensuring improved heat dissipation and increased connection strength by utilizing particles with controlled mechanical properties and thermal stability.
Implementation Method 1
the surfaces of which are coated with an organic substance, as a connecting material, the connection is performed by decomposing the organic substance by heating
Implementation Method 2
by sintering the metal particles to one another is known. In this connection method, metal particles after connection change to a bulk metal, and at the same time, connection by metal bonding is obtained in the connection interface
Data Source
AI summary
A connecting material that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part to ensure the heat dissipation performance, and can increase the connection strength is provided. The connecting material according to the present invention is a connecting material used for forming the connection part that connects two members to be connected, the connecting material contains particles and metal atom-containing particles, the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 μm or more and 300 μm or less, the particles have a 10% K value of exceeding 3000 N/mm2 and 20000 N/mm2 or less, and the particles have a particle diameter CV value of 10% or less.