Connecting Member Reduces Panel Deformation in Electronic Devices
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Solution Overview
Problem
In electronic devices with panels and frames, uneven surfaces cause deformation and issues like dark-state light leakage or mura due to pulling forces from adhesives, leading to displacement and substrate dislocation.
Innovation Solution
Incorporating a connecting member between the adhesive layer and adhesive member, which reduces the pulling force by fixing the panel and back frame directly, thereby alleviating deformation and light leakage issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is used to fix the panel and back frame, then the panel and frame are fixed together, but the panel may be deformed due to pulling force generated between the panel and the frame
Solution Approach 1:
A connecting member is introduced as an intermediary component between the adhesive layer and the back frame. The connecting member includes a first connecting portion adhered to the adhesive layer and a second connecting portion adhered to the back frame, thereby mediating the connection and reducing direct pulling force on the panel.
Solution Approach 2:
The connection structure is segmented into multiple components: the adhesive layer, the connecting member (with first and second connecting portions), and the back frame. This segmentation distributes the adhesive force across multiple interfaces, preventing concentration of stress that would cause panel deformation.
2Stability of the object's composition
If adhesive is attached to a frame with an uneven surface, then the panel and frame are fixed, but dislocation between different substrates in the panel occurs due to pulling force
Solution Approach 1:
The connecting member acts as a mediator that absorbs and distributes the uneven pulling forces generated by adhesive attachment to the uneven back frame surface. This prevents direct transmission of these forces to the panel substrates, avoiding dislocation while maintaining fixation stability.
Solution Approach 2:
The connecting member changes the mechanical parameters of the connection system by introducing additional adhered interfaces and distributing stress across multiple bonding surfaces, thereby reducing the magnitude of pulling forces transmitted to the panel substrates.
3Strength
If adhesive is used to fix the panel and back frame, then the panel is fixed to the frame, but taste issues of dark-state light leakage or mura occur due to pulling force
Solution Approach 1:
The connecting member serves as an intermediary that reduces the pulling force transmitted from the adhesive to the panel. By distributing this force across multiple adhered surfaces, it prevents the panel deformation that causes dark-state light leakage and mura while maintaining necessary fixation strength.
Solution Approach 2:
The connection structure changes the force distribution parameters by creating multiple bonding interfaces through the connecting member. This reduces the concentration of pulling forces on the panel, thereby eliminating the harmful effects of light leakage and mura while preserving fixation strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The connecting member effectively reduces deformation and light leakage by distributing the adhesive force more evenly, improving the fixation and quality of the electronic device.
Implementation Method 1
The adhesive layer is adhered to the panel. The adhesive member is adhered to the back frame.
Data Source
AI summary
An electronic device includes a back frame, a panel, an adhesive layer, an adhesive member, and a connecting member. The panel is arranged on the back frame. The adhesive layer is adhered to the panel. The adhesive member is adhered to the back frame. The connecting member is adhered to the adhesive layer and the adhesive member.