Connecting Pin With Deformable Protrusions for PCB Through-Holes

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The existing press-fit connectors for electronic circuit boards face issues with damage to the coating layer on the inner wall of through-holes during press-fitting, leading to inconsistent fastening forces, especially in high-voltage applications like electric vehicles, where this can result in reduced fastening strength and potential heating problems.

Innovation Solution

A connecting pin with a cylindrical body made of conductive metal, featuring small deformable knurling protrusions on both inner and outer surfaces, which reduces friction resistance and enhances fastening force by engaging with the lead and the coating layer, preventing disconnection due to external forces and stabilizing the pin within the through-hole.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a press-fit connector lead is directly press-fitted into a through-hole of the electronic circuit board, then the connection process is simple and no soldering is required, but the coating layer on the inner wall of the through-hole is damaged and fastening force is insufficient

Engineering Contradiction:
Improveconnection process simplicityVSAvoidfastening force
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

A connecting pin is introduced as an intermediary component between the lead and the through-hole. The connecting pin includes a first protrusion that engages with the lead and a second protrusion that engages with the coating layer on the inner wall of the through-hole, thereby mediating the connection and preventing direct damage to the coating layer while maintaining simple assembly process

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The connecting pin is segmented into distinct functional portions: a cylindrical body, a first protrusion for lead engagement, and a second protrusion for coating layer engagement. This segmentation allows each portion to perform its specific function independently, with the first protrusion providing mechanical retention of the lead and the second protrusion distributing pressure to prevent coating layer damage

Inventive Principle:
Principle #1Segmentation

2Strength

If the lead diameter is larger than the through-hole inner diameter to ensure fixed connection, then the lead is securely retained, but the coating layer on the inner wall is damaged during press-fitting

Engineering Contradiction:
Improveretention forceVSAvoidcoating layer damage
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The connecting pin acts as a mediator with diameter matching the through-hole inner diameter, allowing it to be inserted without excessive force. The first protrusion on the connecting pin engages with the lead (which has diameter larger than through-hole), while the cylindrical body engages with the coating layer, distributing the retention force and preventing localized damage

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The connecting pin changes the dimensional parameters of the connection system. Instead of forcing a large-diameter lead directly into a small-diameter through-hole, the connecting pin provides an intermediate diameter that matches the through-hole, while its protrusions provide the necessary mechanical engagement for retention

Inventive Principle:
Principle #35Parameter changes

3Strength

If press-fitting force is increased to improve fastening strength, then the lead is more securely retained, but the coating layer damage is worsened and heating occurs in high-voltage applications

Engineering Contradiction:
Improvefastening strengthVSAvoidcoating layer damage and heating
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The connecting pin distributes the press-fitting force across its cylindrical body that engages with the coating layer, rather than concentrating force at a single point. This intermediary structure allows for secure retention of the lead through its first protrusion while the second protrusion and cylindrical body distribute the mechanical load to prevent coating layer damage and subsequent heating

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The connecting pin applies different local qualities to different parts of the connection: the first protrusion provides localized engagement with the lead for retention, while the cylindrical body and second protrusion provide distributed engagement with the coating layer to prevent damage, creating localized zones of different stress characteristics

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The connecting pin effectively prevents damage to the coating layer, increases the fastening force between the lead and the circuit board, and enhances mechanical stability, ensuring reliable connections even under external vibrations or shocks.

Implementation Method 1

inner surface of the cylindrical body is provided with a plurality of small protrusions deformable when contacting protrusions of the press-fitted lead

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Implementation Method 2

An outer surface of the cylindrical body may be in contact with the coating layer on the inner wall of the through-hole in the electronic circuit board and may be further provided with a plurality of small protrusions

Methodology Applied
Scientific EffectFriction: Friction

Data Source

PatentUS9543673B2Connecting pin for electronic circuit boards
Publication Date: 2017.01.10 HYUNDAI MOTOR CO LTD
  • US9543673B2 patent drawing
  • US9543673B2 patent drawing
  • US9543673B2 patent drawing

AI summary

A connecting pin for an electronic circuit board electrically connects a lead of a component to be surface-mounted to the electronic circuit board to a coating layer on an inner wall of a through-hole of the electronic circuit board. The connecting pin includes a cylindrical body formed of an electrically conductive metal, which is inserted into the through-hole of the electronic circuit board. The lead of the component is press-fitted, and inner surface of the cylindrical body is provided with a plurality of small protrusions deformable when contacting protrusions of the press-fitted lead.