Connection Assembly Material Bonding for Stability
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Solution Overview
Problem
Existing connection assemblies, particularly those with small wire sizes or using aluminum, face challenges in providing stable and reliable connections due to issues with resistance and long-term stability, especially under elevated temperatures.
Innovation Solution
A method involving the plastic deformation of a connection device around a conductor to form adjacent faces, which are then materially bonded using a sealing material applied before or during deformation, either through soldering or welding, to enhance the connection's stability and resistance to environmental factors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If sealing material is applied after connection device deformation, then the connection assembly can be manufactured with simpler process steps, but the sealing effect is insufficient and the connection stability deteriorates
Solution Approach 1:
The sealing material is applied to the connection device before the deformation process, allowing the sealing material to be positioned and prepared in advance. This preliminary action ensures that the sealing material is already in place to provide the necessary sealing effect when the connection device is deformed, thus improving connection stability without significantly complicating the manufacturing process.
2Reliability
If sealing material is applied to the connection device before deformation, then the connection stability and sealing effect are improved, but the manufacturing process complexity increases
Solution Approach 1:
The application of sealing material and the deformation process are merged into a single integrated manufacturing step. The sealing material is applied to the connection device, and then the same connection device is deformed in sequence without requiring separate equipment or complex coordination between different process steps. This merging approach improves connection stability while minimizing the increase in manufacturing process complexity.
3Productivity
If conventional crimping without material bond is used, then the manufacturing process is simpler and faster, but the connection reliability deteriorates under elevated temperatures and environmental factors
Solution Approach 1:
The connection reliability is improved by changing the physical and chemical parameters of the connection interface. A material bond is created between the connection device and the conductor through controlled material interaction, which significantly enhances the connection's resistance to temperature changes and environmental factors. This parameter change is achieved while maintaining manufacturing efficiency through the integrated process design.
4Reliability
If material bond is created between connection device and conductor, then the connection reliability and resistance to environmental factors are improved, but the manufacturing process becomes more complex
Solution Approach 1:
The sealing material is applied to the connection device before the deformation process, allowing the material bond to be prepared in advance. This preliminary action ensures that the protective layer is already in place to provide resistance to salt spray and corrosion, thus improving environmental resistance without significantly complicating the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a more stable and reliable connection with improved resistance to temperature changes and environmental phenomena, such as salt spray, by creating a strong material bond between the faces of the connection device and conductor, reducing the risk of relaxation and corrosion.
Implementation Method 1
wherein the sealing material is applied as a foam and wherein the sealing material is heated during the production process
Implementation Method 2
plastically deforming a connection device about a conductor and thus moving two faces of the connection device into a position adjacent to each other
Data Source
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AI summary
The invention relates to a connection assembly (1) comprising at least one conductor (2) and at least one connection device (3) which is plastically deformed about the conductor (2) to form two faces (7) which face each other. The invention further relates to a method of manufacturing such a connection assembly (1) and to a tool (10) for manufacturing such a connection assembly (1). The object of the invention is thus to provide a solution that allows to use such connection assemblies (1) in a wider size range and with different materials. This object is achieved by a connection assembly (1) in which the two faces (7) are connected to each other by a material bond (15). An inventive method includes the step of materially bonding the two adjacent faces (7) to each other. An inventive tool (10) comprises a bonding unit (14) for materially bonding the two faces (7) of the connection device (3) to each other.