Connection Chamber Cooling Trap for Solder Vapor Condensation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In the process of forming solder connections in power semiconductor module arrangements, the evaporation of liquid from pre-connection layers can lead to condensation on the chamber walls and ceiling, resulting in droplet formation and contamination, which can weaken the connection and cause module failures.
Innovation Solution
An arrangement that includes a chamber with a heating element and a cooling trap, where the cooling trap is maintained at a lower temperature than the rest of the chamber, attracting and condensing evaporated liquid from the pre-connection layer onto the cooling trap, thereby preventing contamination on the connection partners.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the pre-connection layer is heated to melt it for forming a connection, then the connection strength is improved, but liquid evaporates and condenses on chamber walls forming droplets that contaminate the connection and reduce reliability
Solution Approach 1:
The harmful condensed liquid is extracted from the chamber environment by introducing a cooling trap that selectively captures evaporated liquid in a separate location, removing it from the path where it could contaminate the connection partners
Solution Approach 2:
The cooling trap acts as an intermediary element between the heating zone and the chamber walls, intercepting evaporated liquid and providing a controlled condensation site that prevents uncontrolled droplet formation on critical components
2Productivity
If multiple heating cycles are performed in the same chamber, then productivity is improved, but liquid accumulates on chamber walls and ceiling increasing contamination risk
Solution Approach 1:
The cooling trap continuously captures and collects evaporated liquid during each heating cycle, preventing accumulation on chamber walls and enabling multiple cycles to be performed without increasing contamination risk
Solution Approach 2:
The cooling trap is pre-positioned in the chamber to proactively capture evaporated liquid before it can condense on chamber walls or ceiling, preventing contamination before it occurs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the risk of contamination and strengthens the connection layer by ensuring that evaporated liquid is condensed on the cooling trap rather than on the chamber walls or ceiling, leading to more reliable power semiconductor module connections.
Implementation Method 1
the heating element, when a first connection partner with a pre-connection layer formed thereon is arranged in the chamber, is configured to heat the first connection partner and the pre-connection layer, thereby melting the pre-connection layer
Implementation Method 2
heat the first connection partner and the pre-connection layer, thereby melting the pre-connection layer
Implementation Method 3
When heating the pre-connection layer, liquid which is present in the pre-connection layer may evaporate
Implementation Method 4
the cooling trap has a temperature that is lower than the temperature of all other components of or in the chamber such that liquid evaporating from the pre-connection layer is attracted by and condenses on the cooling trap
Data Source
AI summary
An arrangement includes a chamber, a heating element arranged in the chamber, wherein the heating element, when a first connection partner with a pre-connection layer formed thereon is arranged in the chamber, is configured to heat the first connection partner and the pre-connection layer, thereby melting the pre-connection layer, and a cooling trap. During the process of heating the first connection partner with the pre-connection layer formed thereon, the cooling trap has a temperature that is lower than the temperature of all other components of or in the chamber such that liquid evaporating from the pre-connection layer is attracted by and condenses on the cooling trap.