Connection Film Structure for Multi-Row Terminal Mounting
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Solution Overview
Problem
The challenge lies in efficiently mounting electronic components with multiple terminal rows using existing equipment, particularly when the mounting surface has concave portions, as conventional connection films require multiple applications and risk gas filling, reducing reliability.
Innovation Solution
A method involving a tape-shaped base material and a connection film with a unit region of predetermined length and width, including a non-pasting portion, is used to connect electronic components, allowing for mounting using existing equipment and preventing gas filling in concave portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If connection film is pasted to the entire surface of mounting surface having concave portion, then coverage is improved, but gas fills the concave portion reducing connection reliability
Solution Approach 1:
The connection film is divided into multiple pasting regions corresponding to different terminal rows, with non-pasting regions (voids) positioned to prevent gas accumulation in concave portions. This segmentation allows selective pasting that maintains coverage while ensuring reliable gas evacuation paths.
Solution Approach 2:
Different regions of the connection film have different properties: pasting regions provide adhesive bonding to terminal rows, while non-pasting regions (voids) provide gas evacuation functionality. This local differentiation of film properties resolves the contradiction between coverage and reliability.
2Reliability
If connection film is pasted to each terminal row separately, then connection reliability is improved, but mounting process complexity increases requiring multiple applications
Solution Approach 1:
The connection film incorporates pre-defined non-pasting regions that segment the pasting areas, allowing multiple terminal rows to be addressed in a single pasting operation. This maintains reliable connections while simplifying the mounting process to a single application step.
Solution Approach 2:
The non-pasting regions are pre-formed in the connection film structure before mounting, enabling the film to self-organize during a single pasting operation. This preliminary structuring eliminates the need for multiple sequential pasting steps while ensuring reliable connections to each terminal row.
3Area of stationary object
If connection film covers concave portion, then mounting surface coverage is improved, but gas trapping occurs reducing connection reliability
Solution Approach 1:
The connection film is segmented into pasting regions that cover terminal rows and non-pasting regions (voids) that align with concave portions. This segmentation ensures coverage of mounting surfaces while creating intentional gaps that prevent gas trapping in concave areas.
Solution Approach 2:
The harmful function of the connection film (trapping gas in concave portions) is eliminated by extracting material to create voids in non-pasting regions. These extracted regions specifically target concave portions to enable gas evacuation while maintaining coverage elsewhere.
4Ease of manufacture
If existing equipment is used for mounting, then manufacturing cost is reduced, but mounting capability for complex components is limited
Solution Approach 1:
The connection film with non-pasting regions serves multiple functions: it provides adhesive bonding to terminal rows, creates gas evacuation paths from concave portions, and maintains compatibility with existing single-step pasting equipment. This multi-functionality enables use of existing equipment while expanding mounting capability to complex components.
Solution Approach 2:
The connection film structure is modified by changing the adhesive parameter distribution (pasting regions vs. non-pasting regions) to enable mounting of complex components with concave portions. This parameter change maintains compatibility with existing equipment while expanding adaptability to various component geometries.
Data Source
AI summary
A method of manufacturing a connection structure, connection structure, film structure, and a method of manufacturing a film structure capable of mounting an electronic component having a plurality of terminal rows on a mounting surface by using existing equipment, including: a pasting step of pasting, from a film structure including a tape-shaped base material and a connection film formed thereon, connection films having a unit region of a predetermined length in the length direction of the base material and a predetermined width in the width direction to a first or second electronic component having a plurality of terminal rows; and a connecting step of connecting terminals of the first and second electronic components through the connection films, wherein the film structure includes, in the unit region, in addition to portions corresponding to the plurality of terminal rows, a non-pasting portion in which the connection film is not pasted.