Connection Module With Multi-Conductor Transmission Lines
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Solution Overview
Problem
Current connection modules for test equipment and devices, such as probe cards, face challenges in providing efficient and high-density electrical connections, particularly for millimeter-wave devices, due to limitations in signal transmission and electromagnetic interference shielding, and require innovative solutions to manage fine pitch electrical contacts and multi-conductor transmission lines.
Innovation Solution
The connection module incorporates a multi-conductor transmission line system with a root transmission line and branch transmission lines that operate in transverse electromagnetic (TEM) mode, enclosed in a housing for electromagnetic shielding, and includes switches and thin-film circuits to configure and route signals effectively, enabling efficient connections at fine pitches and reducing module size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional connection modules are used for millimeter-wave devices, then electrical connections can be established, but signal transmission efficiency deteriorates and electromagnetic interference increases
Solution Approach 1:
The connection module is divided into segmented transmission paths with individual shielding for each signal line. Each transmission line is isolated with its own ground reference and shielding structure, preventing electromagnetic coupling between adjacent lines while maintaining signal integrity for millimeter-wave frequencies.
Solution Approach 2:
Ground planes and shielding structures serve as intermediary elements between signal transmission lines. These intermediaries provide electromagnetic shielding and reference potentials, isolating signal lines from external interference and preventing cross-talk while maintaining controlled impedance for optimal signal transmission.
2Quantity of substance
If high-density electrical connections are implemented, then connection density increases, but module size reduction becomes difficult
Solution Approach 1:
The connection module utilizes three-dimensional packaging and vertical stacking of transmission lines and ground planes. Multiple signal paths are arranged in vertical layers rather than only horizontal planes, enabling high connection density while maintaining a compact footprint and reducing overall module volume.
Solution Approach 2:
Transmission lines, ground planes, and shielding structures are nested within each other in a compact hierarchical arrangement. Signal lines are embedded between ground planes, which are themselves nested within outer shielding structures, maximizing space utilization and achieving high connection density in a minimized volume.
3Quantity of substance
If fine pitch electrical contacts are used, then connection density improves, but manufacturing precision requirements increase
Solution Approach 1:
The connection module employs standardized, repeatable transmission line structures and grounding patterns that can be manufactured using conventional PCB or thin-film fabrication processes. These universal designs with built-in alignment features and tolerance compensation enable fine pitch implementations without requiring excessive manufacturing precision.
Solution Approach 2:
The design incorporates controlled impedance transmission lines with specific geometric parameters optimized for millimeter-wave frequencies. By carefully controlling line width, spacing, and substrate thickness parameters during manufacturing, the module achieves reliable fine pitch connections while accommodating normal manufacturing tolerances through parameter optimization rather than requiring ultra-precise fabrication.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables reliable and high-density electrical connections for millimeter-wave devices, effectively managing signal transmission and electromagnetic interference, while reducing the module's size and enhancing flexibility in routing signals, thus addressing the limitations of existing technologies.
Implementation Method 1
The root transmission line and the branch transmission lines are each multi-conductor transmission lines that conduct the signals in transverse electromagnetic (TEM) mode
Implementation Method 2
The housing may be configured to act as a shield against electromagnetic interference to the connection matrix
Data Source
AI summary
An example apparatus includes a connection module. The example connection module includes a connection interface and a connection matrix having a root transmission line to conduct signals to and from the connection interface. The connection matrix also includes branch transmission lines that are connectable electrically to the root transmission line to conduct the signals to and from the root transmission line. Each of the branch transmission lines is part of an electrical pathway between a device and the root transmission line. A housing encloses the connection matrix and enables access to the connection interface. The root transmission line and the branch transmission lines are each multi-conductor transmission lines that conduct the signals in transverse electromagnetic (TEM) mode.