Semiconductor Connection Pad Slits for Bump Peeling
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Solution Overview
Problem
The assembly process of semiconductor devices to substrates, such as display panels, often causes stress leading to peeling of bumps, which are critical for signal transmission and reception.
Innovation Solution
Incorporating a connection pad with slits between the semiconductor substrate and the bump, which reduces internal stress and prevents peeling by alleviating stress concentrations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a connection pad without slits is used, then the bonding strength between bump and substrate is maintained, but stress concentration occurs during assembly causing bump peeling
Solution Approach 1:
The connection pad is segmented by introducing slits that divide the continuous pad structure into multiple sections. These slits allow the connection pad to flex and deform independently in different regions, reducing stress concentration at the bump interface while maintaining overall bonding reliability during assembly processes.
2Reliability
If the connection pad is made wide to improve bonding area, then bonding reliability increases, but stress concentration and peeling risk increase
Solution Approach 1:
By introducing slits into the wide connection pad, the structure is divided into multiple flexible segments. This segmentation allows the wide pad to maintain large bonding area for reliability while the slits prevent stress concentration by enabling localized deformation, thus eliminating the harmful effect of stress concentration even with a wide pad configuration.
Data Source
AI summary
A semiconductor device comprises a semiconductor substrate, a connection pad, and a bump. The connection pad is connected to the bump and disposed between the semiconductor substrate and the bump. The connection pad has one or more slits.