Connection Pin With Internal Solder Cavity For PCB Assembly
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Solution Overview
Problem
The existing methods for mounting connection pins on printed circuit boards (PCBs) require additional steps and space for solder application, leading to reduced component density, increased manufacturing complexity, and risks of solder bridging, which complicates the process and increases costs.
Innovation Solution
A connection pin design that incorporates a cavity with a solder preform, allowing for convenient introduction of solder directly into the pin, eliminating the need for additional solder application steps and reducing space requirements on the PCB, while providing improved mechanical and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional solder paste is applied to secure the pin in the hole, then the mechanical and electrical connection is improved, but the surface space available for circuitry and components is reduced
Solution Approach 1:
The solder preform is nested inside the cavity of the connection pin, allowing the solder to be contained within the pin structure itself rather than occupying space on the PCB surface. This resolves the contradiction by providing sufficient solder for reliable connection while eliminating the need for additional surface space.
Solution Approach 2:
The solder is moved from a two-dimensional surface application (on the PCB) to a three-dimensional internal placement (within the pin cavity). This dimensional transition allows the solder to be contained within the pin's volume rather than occupying valuable PCB surface area.
2Extent of automation
If screen printing or dispensing methods are used to apply solder paste, then the solder application is automated, but the manufacturing process complexity and time are increased
Solution Approach 1:
The solder preform is pre-placed inside the pin cavity during pin manufacturing, before the pin is mounted on the PCB. This preliminary action eliminates the need for separate solder application steps during assembly, reducing manufacturing process complexity and time while maintaining automation.
Solution Approach 2:
The connection pin is designed to be self-sufficient by incorporating the solder preform within its structure. The pin provides its own soldering material, eliminating the need for external solder application equipment and processes, thereby simplifying the manufacturing system.
3Reliability
If additional solder paste is applied to ensure sufficient solder for the pin, then the solder joint reliability is improved, but the risk of solder bridging and manufacturing defects is increased
Solution Approach 1:
The solder preform is precisely positioned within the pin cavity, providing solder exactly where it is needed for the connection. This localized placement ensures sufficient solder for reliable joints while preventing excess solder from spreading to adjacent areas, thereby reducing the risk of solder bridging.
Solution Approach 2:
The solder preform is pre-positioned inside the pin cavity during pin manufacturing, ensuring the correct amount of solder is in place before mounting. This preliminary placement eliminates the variability and control issues associated with applying solder paste during assembly, reducing the risk of manufacturing defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the manufacturing process, reduces defects, and allows for higher component density on PCBs with improved electrical and thermal conductivity, lowering costs and minimizing the risk of solder bridging.
Implementation Method 1
The solder preform will melt and be drawn into the desired solder joint region during the reflow process
Implementation Method 2
The solder wicks down into the hole and up the side of the flange of the pin that is in contact with the solder screen print
Data Source
Figure 1a~2c
Figure 3a~4c
Figure 5a~6b
AI summary
A connection pin (1) comprising a first contact part (13) that is adapted for mounting in a hole in a printed circuit board, PCB,and a second contact part (15). The first contact part comprises a cavity (17) surrounded by a wall (19), and the wall has at least one opening (21). At least one solder preform (25) is located in the cavity (17).A converter assembly comprising a first PCB (20), and having at least one hole (31) in which a connection pin (1) is mounted. The first PCB with the connection pin is then mounted on a second PCB (30). Further is described a method for manufacturing a connection pin comprising: providing a connection pin with a cavity in a contact part of the pin, and providing at least one opening in a wall of the cavity (S1), preparing at least one solder preform (S2), and inserting at least one solder preform into said cavity (S3).