Connection Pin Solder Paste for Narrow-Pitch Bridging Control
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Solution Overview
Problem
There is a need for connection materials with improved stability and reliability, especially for semiconductor connections with narrow pitch spacings, where existing materials face challenges such as bridging, thermal conductivity, and manufacturing method limitations.
Innovation Solution
The development of solder paste for connection pins, characterized by specific particle size distribution, oxygen concentration, and flux composition, which enhances wettability and adhesion, along with connection pins equipped with a solder layer for improved electrical and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If conventional semiconductor mounting with decreasing pitch spacing is used, then electrode integration density is improved, but bridging risk increases
Solution Approach 1:
The connection material is segmented into a pin-shaped structure with a solder layer, separating the mechanical support function (pin) from the bonding function (solder layer). This segmentation allows the pin to maintain physical separation at narrow pitch spacings while the solder layer provides reliable electrical connection, thus reducing bridging risk while maintaining high electrode density.
2Temperature
If metal pin or solder pins with high thermal conductivity are used, then heat dissipation effect is improved, but manufacturing complexity increases
Solution Approach 1:
The connection material uses a composite structure combining a metal pin (providing high thermal and electrical conductivity) with a solder layer (providing bonding capability). This composite approach achieves superior heat dissipation while the standardized manufacturing process for forming the solder layer on the pin keeps production complexity manageable.
3Reliability
If connection pin with high aspect ratio is used, then connection stability is improved, but solder paste wettability becomes more difficult
Solution Approach 1:
The solder paste formulation is optimized with specific flux composition and solder powder particle size distribution (median diameter 3-5 μm, with controlled fine particle content) to enhance wettability on high aspect ratio pins. The flux contains active agents that effectively clean and activate the pin surface, while the controlled particle size ensures proper flow and coverage even on vertical surfaces with high aspect ratios.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution achieves excellent connection reliability, reduced defect rates, enhanced electrical and thermal conductivity, and improved productivity in semiconductor manufacturing, while ensuring stability and accuracy.
Implementation Method 1
the flux having an effect of enhancing the wettability of the solder powder
Implementation Method 2
since the metal pin or solder pins are made of metals with high thermal conductivity, they also exhibit a heat dissipation effect, releasing the heat generated in the semiconductor to the substrate
Data Source
AI summary
In one aspect of the present invention, a solder paste for connection pins is provided, comprising:solder powder that includes tin, has a mean diameter of 3˜5 μm, and wherein the proportion of powder particles with a diameter of 8 μm or more is less than 1 wt %; anda flux that enhances the wettability of the aforementioned solder powder.