Electronic Device Module Connective Conductor Insulation Spacing
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Solution Overview
Problem
Current electronic device manufacturing methods face challenges in miniaturization and integration, particularly in forming external terminals on molded parts while ensuring reliable connectivity and protection of electronic components.
Innovation Solution
An electronic device module is designed with a board featuring mounting and external connection electrodes, a molded part sealing the components, and connective conductors that penetrate through the molded part, with a protective insulation layer spaced apart from the conductors to facilitate plating and enhance bonding, allowing for efficient manufacturing and integration of multiple devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external terminals are formed on the molded part surface, then connectivity reliability is enhanced, but the risk of delamination and oxidation increases
Solution Approach 1:
A protective insulation layer is introduced as an intermediary between the connective conductor and the external environment. This layer prevents direct exposure of the conductor to oxidizing conditions and eliminates delamination issues by providing a stable insulating barrier, while still allowing the conductor to penetrate the molded part and connect external terminals.
Solution Approach 2:
The protective insulation layer is formed on the board surface before the connective conductor penetrates through the molded part. This preliminary protective measure ensures that the conductor is already protected from oxidation and delamination risks before it establishes its connection path, preventing harmful effects from occurring in the first place.
2Ease of manufacture
If the protective insulation layer is spaced apart from the connective conductor, then plating process efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The protective insulation layer is positioned to cover only the external connection electrode areas where plating is needed, while leaving the connective conductor penetration areas exposed. This localized insulation approach enables efficient plating on the board surface without requiring the entire structure to be insulated, thus avoiding excessive manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the reliable formation of external terminals on molded parts, ensuring secure connectivity and protection of electronic components, while allowing for the miniaturization and integration of multiple devices within a single module, improving manufacturing efficiency and reducing the risk of delamination during the plating process.
Implementation Method 1
at least one connective conductor of which one end is bonded to the external connection electrode of the board and which penetrates through the molded part to be disposed in the molded part
Implementation Method 2
forming at least one connective conductor in the via hole by using a plating method
Implementation Method 3
a molded part sealing the electronic device
Data Source
AI summary
An electronic device module includes: a board including at least one mounting electrode and at least one external connection electrode and having a protective insulation layer which is provided on an outer surface thereof; at least one electronic device mounted on the mounting electrodes; a molded part sealing the electronic device; and at least one connective conductor of which one end is bonded to the external connection electrode of the board and which penetrates through the molded part to be disposed in the molded part, wherein the protective insulation layer is disposed to be spaced apart from the connective conductor.