Connectivity Rings for SADP Compliant Via Layouts
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Solution Overview
Problem
Existing electronic design tools face challenges in creating self-aligned double patterning (SADP) compliant layouts for standard cells, leading to area penalties and reduced design flexibility due to the need for complex post-processing and additional mandrels.
Innovation Solution
The approach involves generating multiple connectivity rings within the design layout, each from different material types, and applying cuts to isolate vias of different net types, allowing for improved control over electrical characteristics and SADP compliance without connecting vias of differing net types.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If complex post-processing with mandrels is used to achieve SADP compliance, then SADP compliance is improved, but area penalty increases and design flexibility degrades
Solution Approach 1:
The design layout is segmented into multiple pattern sets (first pattern set and second pattern set) that can be independently processed and combined. This segmentation allows SADP compliance to be achieved through systematic pattern division rather than adding area-consuming mandrels, as each segment can be optimized independently for both compliance and area efficiency.
Solution Approach 2:
The methodology performs preliminary actions by pre-processing the design layout to identify and prepare pattern sets before final SADP compliance checking. Cuts and pattern assignments are determined in advance, allowing the design to be configured for SADP compliance from the outset rather than requiring additional area after layout completion.
2Manufacturing precision
If complex post-processing with mandrels is used to achieve SADP compliance, then SADP compliance is improved, but design flexibility degrades
Solution Approach 1:
The design methodology employs dynamic pattern assignment where cuts and pattern set assignments can be adjusted based on specific design requirements. The system can dynamically determine which vias connect to which pattern sets, allowing design flexibility to be maintained while achieving SADP compliance through adaptive rather than fixed mandrel-based approaches.
Solution Approach 2:
The methodology changes key parameters by transitioning from fixed mandrel positions to variable pattern set assignments. Cuts can be placed at different locations and pattern sets can be assigned to different via groups based on design needs, providing parameter variability that maintains design flexibility while ensuring SADP compliance through systematic parameter control.
3Reliability
If connectivity rings with cuts are used to isolate vias of different net types, then control over electrical characteristics is improved, but device complexity increases
Solution Approach 1:
The connectivity rings serve multiple functions: they provide electrical connectivity for vias of the same net type, enforce isolation between different net types through cuts, and enable systematic pattern assignment for SADP compliance. This multi-functionality reduces the need for separate dedicated structures, managing complexity while improving electrical control.
Solution Approach 2:
The methodology manages complexity by transitioning from two-dimensional planar layout thinking to incorporating a third dimension of pattern set assignment. Cuts and connectivity ring assignments operate in this additional dimensional space, allowing complex electrical isolation requirements to be satisfied through systematic assignment rather than physically complex three-dimensional structures.
Data Source
AI summary
Among other things, one or more techniques and/or systems for performing design layout are provided. In an example, a design layout corresponds to a layout of a standard cell whose connectivity is described by a netlist. For example, the netlist specifies net types for respective vias of the standard cell. One or more connectivity rings are formed within the design layout to provide connectivity for one or more vias of the design layout. For example, a first connectivity ring is generated, such as from mandrel, to connect one or more ring one vias. A second connectivity ring is generated, such as from passive pattern, to connect one or more ring two vias. One or more cuts are generated within the design layout to isolate vias having different net types. In this way, the design layout is self-aligned double patterning (SADP) compliant.