Connector Acute Angle Lead Staggering Reduces Crosstalk
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Solution Overview
Problem
High-speed signal transmission in electronic devices faces challenges due to cross talk noise, which increases with proximity between differential signal pairs and signal speed, affecting signal integrity.
Innovation Solution
A connector design with leads arranged in columns at an acute angle to each other, reducing mutual inductance and cross talk between differential pairs, and incorporating shielding and staggered arrangements to minimize noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If differential signal pairs are arranged in parallel columns for high-speed signal transmission, then signal transmission capability is improved, but cross talk noise increases due to proximity between adjacent pairs
Solution Approach 1:
The patent rotates differential signal pairs from a parallel column arrangement to a staggered diagonal arrangement at an acute angle (e.g., 45 degrees) relative to the column direction. This dimensional change in lead orientation reduces the overlapping surface area between adjacent differential pairs, thereby decreasing mutual inductance and cross talk noise while maintaining high-speed signal transmission capability
2Area of stationary object
If adjacent differential signal pairs are placed close together to reduce connector size, then device miniaturization is achieved, but cross talk noise increases due to reduced spacing
Solution Approach 1:
By staggering differential pairs at an acute angle rather than arranging them in parallel columns, the patent achieves a more efficient space utilization. This diagonal arrangement allows pairs to be placed closer together in the connector footprint while the reduced overlapping surface area between adjacent pairs minimizes mutual inductance and cross talk, thus enabling device miniaturization without sacrificing signal integrity
Solution Approach 2:
The patent introduces asymmetry in the arrangement of differential signal pairs by staggering them at different positions along the column direction and orienting them at acute angles. This asymmetric staggered pattern disrupts the symmetry that would otherwise maximize coupling between adjacent pairs, thereby reducing cross talk while maintaining compact connector dimensions
3Ease of manufacture
If leads are arranged in parallel columns for ease of manufacturing, then manufacturing simplicity is improved, but signal integrity deteriorates due to increased mutual inductance between adjacent pairs
Solution Approach 1:
The patent modifies the traditional parallel column lead arrangement by rotating differential pairs to extend at an acute angle to the column direction, creating a staggered diagonal pattern. This dimensional change in lead orientation reduces the overlapping surface area between adjacent pairs, thereby decreasing mutual inductance and improving signal integrity while remaining compatible with standard manufacturing processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances signal integrity by reducing cross talk noise, improving performance, and allowing for cost-effective manufacturing with modular components.
Implementation Method 1
mutual inductance between adjacent differential pairs and thus pair cross talk in the adjacent columns is reduced
Data Source
AI summary
A connector (103) is provided having a plurality of leads generally arranged in columns extending substantially parallel each other in a column direction (C) and being adjacent each other in a row direction (R). At least one first column comprises at least one first pair of single leads (S) substantially parallel each other in a first pair direction (P) to form a first differential pair. In at least a portion of the connector the first pair direction extends at an acute angle (a) to the column direction. Further, an assembly, and a circuit board are provided.