Vertical Conductive Connector Adhesion via Annealing Diffusion
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Solution Overview
Problem
The challenge in substrate technology is to improve the adhesion strength of vertical conductive connectors, such as plating through holes, due to differences in material properties, which affects product reliability.
Innovation Solution
A substrate structure and manufacturing method that includes a substrate with a heat resistance temperature of 300° C. or greater, and a vertical conductive connector with a bonding structure formed by diffusing atoms through an annealing process, enhancing adhesion strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If vertical conductive connectors are formed in substrate using conventional methods, then manufacturing is simple, but adhesion strength is low
Solution Approach 1:
The patent applies preliminary action by forming a bonding structure at the interface between the vertical conductive connector and substrate before final assembly. This bonding structure, created through annealing diffusion, pre-establishes strong adhesion bonds that prevent subsequent delamination issues, thereby improving adhesion strength without significantly complicating the overall manufacturing process.
Solution Approach 2:
The patent utilizes parameter changes by controlling the annealing process parameters (temperature, time, atmosphere) to optimize atomic diffusion. By adjusting these parameters, the bonding structure achieves optimal adhesion strength while managing process complexity. The heat resistance temperature of 300°C or greater is a critical parameter that enables effective diffusion bonding.
2Strength
If material properties differ between vertical conductive connectors and other components, then manufacturing is easier, but adhesion strength decreases
Solution Approach 1:
The bonding structure acts as an intermediary layer between the vertical conductive connector and the substrate. This intermediate bonding structure, formed through atomic diffusion during annealing, mediates the interface between materials with different properties, ensuring strong adhesion and improving overall product reliability despite material property differences.
Solution Approach 2:
The patent effectively creates a composite structure at the interface by forming a bonding structure that combines atoms from the vertical conductive connector with atoms from the substrate. This composite bonding structure leverages the beneficial properties of both materials while achieving superior adhesion strength compared to direct material contact.
3Strength
If annealing process is performed to diffuse atoms and form bonding structure, then adhesion strength is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent merges the annealing process with existing manufacturing steps by integrating it into the overall fabrication sequence. The annealing process is combined with the formation of vertical conductive connectors and substrate preparation steps, allowing multiple functions to be achieved in a unified process flow, thereby reducing the impact on manufacturing ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively enhances the adhesion strength between vertical conductive connectors and adjacent components, thereby improving product reliability.
Implementation Method 1
An annealing process is performed to diffuse a plurality of first atoms in the vertical conductive connector toward the substrate to form a bonding structure
Implementation Method 2
An electro-plating process is performed to respectively form a vertical conductive connector in the plurality of through holes
Data Source
AI summary
A substrate structure includes a substrate and a vertical conductive connector. The substrate includes a material with a heat resistance temperature of 300° C. or greater. The vertical conductive connector penetrates through the substrate. The vertical conductive connector has a bonding structure extending toward the substrate. A manufacturing method of the substrate structure is also provided.