Connector Structure for Stable Conductive Adhesive Bonding
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Solution Overview
Problem
Existing connectors in semiconductor devices face issues with maintaining a sufficient thickness of conductive adhesive while preventing the head part from sinking into the adhesive, which can lead to loss of balance and reliability concerns.
Innovation Solution
The design incorporates a single first projection part for point contact with the semiconductor element's front surface and a support surface on the proximal end part, along with optional second projection parts, to ensure a sufficient adhesive thickness and prevent balance loss even when the head part sinks into the conductive adhesive.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a large-sized connector is adopted to handle larger current, then the current carrying capacity is improved, but the connector may sink into the conductive adhesive and come into contact with the semiconductor element, causing loss of balance and reliability issues
Solution Approach 1:
The connector is divided into multiple parts: a head part (40) for electrical connection, a proximal end part (45) with support surfaces for stable bonding, and intermediate connection parts. This segmentation allows the heavy head part to be supported by distributed contact points, preventing sinking into the conductive adhesive while maintaining current carrying capacity.
Solution Approach 2:
The proximal end part is designed with predetermined support surfaces (46) and protrusion parts (49) that are positioned in advance to contact the conductor layer (70) before the head part settles. This preliminary support structure prevents the connector from sinking into the conductive adhesive (75) during the bonding process, ensuring stable positioning.
2Reliability
If a sufficient thickness of conductive adhesive is used to improve reliability, then the bonding strength is improved, but the connector head part may sink into the adhesive, causing loss of balance
Solution Approach 1:
The connector has different structural characteristics at different locations: the head part (40) is designed for electrical contact with point contact capability, while the proximal end part (45) has extended support surfaces (46) and protrusion parts (49) that provide distributed support. This local differentiation allows the connector to maintain balance even with thick conductive adhesive by distributing the load across multiple support points rather than concentrating it at the head part.
3Reliability
If the connector head part comes into contact with the semiconductor element due to sinking, then the electrical connection is established, but the loss of balance occurs and reliability is compromised
Solution Approach 1:
The conductive adhesive (75) serves as an intermediary material between the connector's proximal end part (45) and the conductor layer (70), while the support surfaces (46) and protrusion parts (49) act as intermediaries to distribute the connector's weight. This intermediary structure ensures that the head part (40) can make proper contact with the semiconductor element for electrical connection without the connector sinking and losing balance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for secure fixation and bonding of the connector, preventing balance loss and ensuring a sufficient adhesive thickness, while also reducing the risk of cracks and improving the bonding process by allowing the adhesive to form a fillet around the recessed areas.
Implementation Method 1
connect, via a connector, a front surface of the semiconductor element and a terminal by using a conductive adhesive such as solder
Implementation Method 2
The large-sized connector thus adopted may sink into the conductive adhesive, and come into contact with the semiconductor element on a head part side
Data Source
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AI summary
An electronic device has a sealing part 90, an electronic element 95 provided in the sealing part 90, a first terminal that projects outward from the sealing part 90 and a connector 51 that has a head part 40 connected to a front surface of the electronic element 95 via a conductive adhesive 75, and a proximal end part 45 connected to the first terminal via a conductor layer 75. The head part 40 has a single first projection part 41 that projects toward the electronic element 95. The first projection part 41 sinks into the conductive adhesive 75 and comes into point contact with the front surface of the electronic element 95. The proximal end part 45 has a plurality of protrusion parts 49 or a support surface 46, contacting the conductor layer 70.