Electrical Connector Air Flow Channel Design

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Solution Overview

Problem

Existing electrical connectors have a high center of gravity and small contact area with circuit boards, leading to instability during fixing, and poor heat dissipation due to lack of air flow channels, making them difficult to assemble and less reliable.

Innovation Solution

The electrical connector design features a shell with a bridging portion and two frame portions that define air flow channels, along with supporting portions for stable placement and screw fixation, enhancing contact area and heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the electrical connector has a narrow width to reduce size, then the device complexity is reduced, but the contact area with the circuit board becomes small leading to instability

Engineering Contradiction:
Improveconnector sizeVSAvoidconnector stability
Core Design Contradiction:
Volume of moving objectVSStability of the object's composition

Solution Approach 1:

The patent extends the connector in the vertical dimension by adding multiple stacked layers (first layer, second layer, third layer) with multiple cards per layer. This increases the contact area with the circuit board and lowers the center of gravity without increasing the horizontal footprint, thus improving stability while maintaining a compact size.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent combines multiple cards and layers into a single integrated connector assembly. Multiple cards are arranged in parallel on each layer, and multiple layers are stacked vertically, merging multiple connection functions into one unified structure that provides both compact size and enhanced stability through increased contact area.

Inventive Principle:
Principle #5Merging (Combining)

2Stability of the object's composition

If the connector is fixed tightly to the circuit board to improve stability, then the reliability is improved, but the fixing operation becomes more complex and time-consuming

Engineering Contradiction:
Improveconnector stabilityVSAvoidfixing operation ease
Core Design Contradiction:
Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

The connector is designed with pre-formed mounting structures including through-holes and positioning features that align with the circuit board. The multi-layer stacked structure provides inherent mechanical support and distribution of fixing forces, allowing for simplified assembly operations while maintaining tight fixation and stability.

Inventive Principle:
Principle #10Preliminary action

3Device complexity

If the connector structure is simplified to reduce device complexity, then the ease of manufacture is improved, but the heat dissipation capability deteriorates

Engineering Contradiction:
Improveconnector structure complexityVSAvoidheat dissipation
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The connector is segmented into multiple independent layers and cards, creating numerous exposed surfaces and interfaces. This segmentation increases the total surface area available for heat dissipation while maintaining a relatively simple overall structure. Each layer and card can dissipate heat independently, improving thermal management without requiring complex cooling systems.

Inventive Principle:
Principle #1Segmentation

4Reliability

If multiple cards are stacked in multiple layers to increase contact area and improve stability, then the reliability is improved, but the device complexity increases

Engineering Contradiction:
Improveconnector reliabilityVSAvoidconnector structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The connector uses standardized cards and layers that can serve multiple functions: electrical connection, mechanical support, and heat dissipation. The modular design allows the same basic structure to be replicated across multiple layers and cards, improving reliability through redundancy while managing complexity through standardization and modularity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS10693249B2Electrical connector having wafer groups assembled to slots
Publication Date: 2020.06.23 MOLEX INC
  • US10693249B2 patent drawing
  • US10693249B2 patent drawing
  • US10693249B2 patent drawing

AI summary

The present disclosure discloses an electrical connector which comprises a shell, a first wafer group and a second wafer group. The shell comprises: a first frame portion defining a first slot; a second frame portion defining a second slot; a first supporting portion positioned at a first side of the shell; a second supporting portion positioned at a second side of the shell, and a bridging portion connecting the first frame portion and the second frame portion. The bridging portion, the first frame portion and the second frame portion cooperatively define an air flow channel. The first wafer group is assembled to the first slot. The second wafer group is assembled to the second slot.