Connector Alignment Structure for Hybrid Signal Routing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic devices face challenges in efficiently managing high-speed and low-speed signals due to host board bottlenecks, leading to inefficient signal distribution and potential electromagnetic interference.
Innovation Solution
The implementation of shielded bypass connector modules that utilize a hybrid signal transmission system, where high-speed signals are directed off the host board via cables and low-speed signals are transmitted to the host board, while being shielded from electromagnetic interference through a comprehensive shield assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If all signals are transmitted through the host board, then signal distribution is simplified, but host board density increases and electromagnetic interference occurs
Solution Approach 1:
The patent segments signal transmission paths into two categories: high-speed signals are routed directly to cable connections bypassing the host board, while low-speed signals continue through the host board. This segmentation reduces host board density and eliminates electromagnetic interference for high-speed signals by removing them from the shared board environment.
Solution Approach 2:
The patent extracts high-speed signal transmission paths from the host board system and creates dedicated cable connections for these signals. By taking out the high-speed signal routes from the host board infrastructure, the patent reduces board density and prevents electromagnetic interference while maintaining simplified signal distribution for remaining low-speed signals.
2Object-affected harmful factors
If high-speed signals are routed directly off the host board, then electromagnetic interference is reduced, but connector complexity increases
Solution Approach 1:
The patent implements a universal connector design that handles both high-speed and low-speed signals through a single interface structure. The connector is configured to accommodate direct cable connections for high-speed signals while maintaining compatibility with standard host board connections for low-speed signals, thereby reducing overall connector complexity despite the dual-path configuration.
Solution Approach 2:
The patent merges the high-speed and low-speed signal transmission functions into a single integrated connector assembly. By combining both signal types in one connector structure with unified mounting and alignment features, the patent reduces the number of separate connectors needed and simplifies the overall connection system while maintaining electromagnetic isolation for high-speed paths.
3Productivity
If a hybrid signal transmission system is implemented, then signal distribution efficiency is enhanced, but alignment precision requirements increase
Solution Approach 1:
The patent incorporates preliminary alignment features directly into the connector structure, including positioning protrusions and guiding structures that pre-establish correct alignment during assembly. These built-in alignment mechanisms ensure precise positioning of both high-speed and low-speed signal paths before signals are transmitted, thereby enabling efficient hybrid signal distribution without requiring post-assembly alignment adjustments.
Data Source
AI summary
An electronic device is provided with a first connector module configured to mate with an external plug. The first connector module includes a first set of terminals; a first wafer supporting the first set of terminals, a first one or more of the second ends of the first set of terminals are bent to form a first set of tails, and a second one or more of the second ends of the first set of terminals terminate within the first wafer; and a tail alignment structure positioned to support the first set of tails. The electronic device further includes a cable arrangement forming a connection with the second one or more of the second ends of the first set of terminals; a host board configured to form an electrical connection with the first set of tails; and a shield assembly.


