Electrical Connector Assembly With 3-Row PCB Pad Layout

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Solution Overview

Problem

Existing electrical connector assemblies lack efficient use of printed circuit board (PCB) space and structural design for compactness and easy assembly, leading to larger sizes and potential interconnection complexities.

Innovation Solution

The electrical connector assembly features a bracket with mounted transmission assemblies, including a PCB with conductive pads arranged in specific orientations for perpendicular connections, and a bracket design with slots and legs for accommodating connectors, allowing for efficient PCB space utilization and interlocking mechanisms for compact assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If traditional PCB layouts with limited conductive pad arrangements are used, then the assembly process is simpler, but the device size cannot be reduced and space utilization is poor

Engineering Contradiction:
Improvedevice sizeVSAvoidPCB layout complexity
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent transitions from traditional single-row or dual-row conductive pad arrangements to a three-dimensional spatial configuration with conductive pads arranged in multiple rows (first row at bottom end, second row at front end, third row at rear end) across different faces of the PCB. This dimensional expansion allows more connection points within a smaller footprint, reducing overall device size while maintaining connectivity requirements.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The conductive pads are segmented into three distinct rows positioned at different locations on the PCB (bottom end, front end, rear end), with each row serving specific connection functions. The board-mount connector connects to the first row, plug-in connectors connect to the second row, and additional connections are made at the third row. This segmentation enables optimized space utilization and reduces device dimensions.

Inventive Principle:
Principle #1Segmentation

2Adaptability or versatility

If more conductive pads and connectors are added to increase functionality, then interconnection efficiency improves, but the device size and structural complexity increase

Engineering Contradiction:
Improveinterconnection efficiencyVSAvoidPCB area
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent implements a nested arrangement where multiple conductive pad rows are integrated into a compact PCB structure. The first row of conductive pads is arranged on a first face of the PCB, while the second and third rows are arranged on a second face opposite the first face, creating a nested three-dimensional configuration that maximizes interconnection efficiency within minimal PCB area.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

By utilizing both faces of the PCB and arranging conductive pads in three rows across different locations and orientations, the patent achieves high interconnection efficiency without proportionally increasing PCB area. The perpendicular arrangement of the first and second rows, along with the third row at the rear end, creates efficient spatial utilization.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Area of stationary object

If perpendicular arrangements of conductive pads are used, then space utilization improves, but manufacturing precision requirements increase

Engineering Contradiction:
ImprovePCB space utilizationVSAvoidpad alignment precision
Core Design Contradiction:
Area of stationary objectVSManufacturing precision

Solution Approach 1:

The conductive pads are divided into three separate rows positioned at distinct locations on the PCB (bottom end, front end, rear end), with each row having its own set of connection requirements. This segmentation allows for modular manufacturing and assembly processes, where each row can be independently managed, reducing the overall precision burden compared to a single complex arrangement.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The nested configuration of conductive pad rows across different PCB faces and locations enables efficient space utilization while distributing manufacturing precision requirements across multiple independent connection points, making the overall manufacturing process more manageable.

Inventive Principle:
Principle #7Nested doll (Nesting)

Data Source

PatentUS11923630B2Electrical connector assembly including an internal circuit board having three rows of conductive pads respectively at three end portions thereof
Publication Date: 2024.03.05 FOXCONN INTERCONNECT TECHNOLOGY LTD
  • US11923630B2 patent drawing
  • US11923630B2 patent drawing
  • US11923630B2 patent drawing

AI summary

An electrical connector assembly includes: a bracket; and at least one transmission assembly mounted to the bracket and including an internal printed circuit board (PCB), a board-mount connector connected to a first row of conductive pads disposed at a bottom end portion of the PCB, and a plug-in connector connected to a second row of conductive pads disposed at a front end portion of the PCB, wherein the PCB has a third row of conductive pads disposed at a rear end portion thereof.