Connector Assembly Shielding and Tensile Strength
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Solution Overview
Problem
Existing connector assemblies suffer from poor electromagnetic shielding and tensile performance due to exposed soldering pins and conductive traces, as well as vulnerability to external pulling forces that can cause the cable wire to separate from the circuit board.
Innovation Solution
A connector assembly with an outer shield housing that encloses the connector, cable, and circuit board, featuring a conductive terminal soldered to the first soldering pin, a crimp ring to distribute pulling forces, and an elastic sheet for enhanced electrical contact, improving shielding and tensile strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the connector is soldered to the circuit board and electrically connected through the circuit board, then electrical connection is achieved, but the soldering pins and conductive traces are directly exposed to the outside area, resulting in poor electromagnetic shielding performance
Solution Approach 1:
The patent implements a nested structure where the inner shield housing is placed inside the outer shield housing, creating multiple layers of electromagnetic shielding. The inner shield housing covers the connector and circuit board, while the outer shield housing provides an additional shielding layer, effectively containing electromagnetic emissions without requiring complete redesign of the entire assembly.
Solution Approach 2:
The shield housing is divided into separate components (inner shield housing and outer shield housing) that can be independently manufactured and assembled. This segmentation allows for easier manufacturing and assembly while achieving comprehensive electromagnetic shielding coverage over the soldering pins and conductive traces.
2Strength
If the cable wire is soldered to the circuit board, then electrical connection is achieved, but when the cable is subjected to external pulling force, the wire is easily separated from the circuit board, resulting in poor tensile performance
Solution Approach 1:
The patent incorporates a stress relief structure that is pre-configured in the circuit board to absorb and distribute pulling forces before they reach the solder joints. This preliminary structural arrangement prevents the wire from being easily pulled away during operation, enhancing tensile performance without requiring additional fastening components.
3Object-affected harmful factors
If the connector assembly uses traditional soldering connection without additional shielding structures, then manufacturing is simple, but the soldering pins and conductive traces are exposed, resulting in poor electromagnetic shielding
Solution Approach 1:
The nested shield housing structure allows each shielding layer to be independently manufactured and then assembled together, maintaining manufacturing simplicity while achieving superior electromagnetic shielding. The inner and outer shield housings can be produced using standard manufacturing processes and then fitted together during assembly.
4Reliability
If the cable wire is directly soldered to the circuit board without stress relief structures, then the structure is simple, but the wire is vulnerable to external pulling forces, resulting in poor reliability
Solution Approach 1:
The stress relief structure is built into the circuit board design from the beginning, creating a preliminary structural arrangement that proactively manages pulling forces. This prevents wire separation before it can occur during normal use, enhancing connection reliability without requiring complex additional components or assembly steps.
Data Source
AI summary
A connector assembly includes a connector, a circuit board having a first soldering pin and a second soldering pin electrically connected with the first soldering pin, a cable having a wire with a conductor, and an outer shield housing mounted on the circuit board and covering the connector, the cable, and the circuit board. The connector includes a shield housing, an insulation body disposed in the shield housing, and a conductive terminal held in the insulation body. The conductive terminal is soldered to the first soldering pin. The conductor is soldered to the second soldering pin.