Connector Assembly Thermal Conduction Members
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Solution Overview
Problem
Current plug connectors face challenges in efficiently dissipating heat generated by high-speed chips, leading to potential device failure due to the low thermal conductivity of metal shells, which impairs signal transmission reliability.
Innovation Solution
A connector assembly incorporating thermal conduction members with first and second mating portions that form a thermal connection when the plug connector is inserted, allowing for efficient heat transfer from the chip to the thermal conduction members and subsequent dissipation, utilizing materials with higher thermal conductivity than traditional metal shells.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a metal shell is used for heat dissipation, then the structure is simple and easy to manufacture, but the thermal conductivity is low resulting in slow heat transfer rate
Solution Approach 1:
The patent uses a copper-based alloy material for the thermal conduction member that combines high thermal conductivity with structural integrity. The copper-based alloy integrates the beneficial properties of copper (high thermal conductivity) with other elements to achieve both excellent heat transfer performance and ease of manufacturing through conventional processes.
Solution Approach 2:
The patent changes the material parameters by selecting a copper-based alloy with specific thermal conductivity properties. The material has thermal conductivity of at least 200 W/(m·K), which is significantly higher than traditional metal shells, while maintaining manufacturability through standard fabrication techniques.
2Reliability
If a chip is installed to enhance decoding capability, then the data transmission bandwidth and signal quality are improved, but the heat generation increases leading to potential device failure
Solution Approach 1:
The thermal conduction member acts as an intermediary between the chip and the external environment. It provides a dedicated thermal pathway that mediates heat transfer from the chip, preventing heat accumulation while allowing the chip to maintain high performance for reliable signal transmission.
Solution Approach 2:
The heat dissipation function is segmented from the structural metal shell and assigned to a dedicated thermal conduction member. This segmentation allows the thermal management function to be optimized independently with high thermal conductivity material, while the metal shell maintains its structural and electrical functions.
3Device complexity
If the metal shell is used for heat exchange, then the structure is simple, but the thermal conductivity is low resulting in poor heat dissipation effect
Solution Approach 1:
The patent employs a copper-based alloy material that serves as a composite solution, achieving high thermal conductivity (≥200 W/(m·K)) while maintaining a relatively simple structural form. This composite material approach delivers superior heat dissipation effect without significantly increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables quick heat dissipation from the chip, enhancing the reliability of signal transmission and preventing device failure by utilizing thermal conduction members with higher conductivity than traditional metal shells, effectively addressing the inefficiencies in existing heat dissipation methods.
Implementation Method 1
at least one second thermal conduction member, provided on the insulating body, wherein the second thermal conduction member has a second mating portion and a conducting portion, and the conducting portion is thermally conducted with the chip
Data Source
AI summary
A connector assembly includes a socket connector and a plug connector. The socket connector includes a main body having a tongue; multiple mating terminals having multiple first contact portions; a shell surrounding the tongue to form an accommodating cavity; and a first thermal conduction member. The first contact portions are exposed from at least one first surface of the tongue and are arranged in a left-right direction. The first thermal conduction member has a first mating portion accommodated in the accommodating cavity, and the first mating portion and the tongue are provided at intervals in the left-right direction. The plug connector includes a circuit board; a chip, provided on the circuit board; a mating joint having an insulating body and multiple conductive terminals provided on the insulating body; and a second thermal conduction member having a second mating portion and a conducting portion thermally conducted with the chip.