Connector Assembly Thermal Contact for Heat Dissipation

Solution Overview

Problem

In communication devices, heat generated inside the device is not effectively transferred to the connection base, leading to high temperatures and potential malfunctions due to inadequate heat dissipation.

Innovation Solution

A connector assembly design where the connection base is in thermal contact with the receptacle, utilizing a heat dissipating block and heat radiating ribs to facilitate heat transfer from the receptacle to the connection base, which is then dissipated outside the device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the receptacle is not in contact with the connection base, then the structural design is simple and easy to manufacture, but heat generated inside the communication device cannot be transferred to the connection base, causing high temperature and potential malfunction

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidconnector assembly structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the receptacle and connection base by making them in direct thermal contact. The receptacle is positioned within the connection base such that its outer wall is in direct contact with the inner wall of the connection base, creating a thermal conduction path that allows heat to be transferred from the receptacle to the connection base and dissipated to the external environment.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces a heat dissipation block as an intermediary component between the receptacle and connection base. This heat dissipation block is in thermal contact with both the receptacle and the connection base, facilitating heat transfer from the receptacle through the heat dissipation block to the connection base, thereby improving heat dissipation performance without requiring direct contact between the receptacle and connection base.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If the receptacle is not in contact with the connection base, then the manufacturing process is simple, but heat is retained inside the housing without being easily dissipated, causing the communication device to malfunction due to high temperature

Engineering Contradiction:

Improvedevice operation reliabilityVSAvoidconnector assembly manufacturing

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges the receptacle and connection base by making them in direct thermal contact. The receptacle is positioned within the connection base such that its outer wall is in direct contact with the inner wall of the connection base, creating a thermal conduction path that allows heat to be transferred from the receptacle to the connection base and dissipated to the external environment.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces a heat dissipation block as an intermediary component between the receptacle and connection base. This heat dissipation block is in thermal contact with both the receptacle and the connection base, facilitating heat transfer from the receptacle through the heat dissipation block to the connection base, thereby improving heat dissipation performance without requiring direct contact between the receptacle and connection base.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances heat dissipation performance, preventing overheating and ensuring the communication device operates reliably by transferring heat from the device interior to the exterior through the connection base.

Implementation Method 1

The connection base is in thermal contact with the receptacle, allowing heat to be transferred from the receptacle to the connection base and dissipated outside the communication device

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The receptacle is mounted with a heat dissipating block adapted to be in thermal contact with an inner wall of the connection base

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

The main body portion of the connection base has an outer wall formed with a heat radiating rib protruding outwardly

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentEP3557698B1Connector assembly

Publication Date: 2021.08.04 TYCO ELECTRONICS (SHANGHAI) CO LTD

Figure 1A~1B
Figure 2~3
Figure 4~5

AI summary

A connector assembly adapted to connect a plug (300) to a communication device is disclosed. The connector assembly includes a receptacle (100) adapted to be fixed on a circuit board (10) of the communication device and mated with the plug, and a connection base (200) adapted to be fixed on a housing panel (20) of the communication device. The connection base has a main body portion (210) located outside the housing panel of the communication device. The connection base is formed with an insertion cavity (201) adapted to receive at least a portion of the receptacle. The connection base is in thermal contact with the receptacle. Thus, heat inside the communication device may be transferred to the connection base and rapidly dissipated outside the communication device through the connection base, thereby improving the heat dissipation performance of the communication device and effectively preventing the communication device from malfunction due to overheating.