Connector Block with Segmented Through Connections
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Solution Overview
Problem
There is a need for a reliable and flexible method to establish electric interconnections between opposing surface regions of semiconductor packages, particularly for vertical signal propagation and power connections, while accommodating different frequency and power requirements.
Innovation Solution
A connector block design featuring encapsulated first electrically conductive through connections with larger cross-sectional areas for power and ground tasks, and second conductive through connections with smaller cross-sectional areas for high-frequency signal transmission, embedded within an encapsulant that provides mechanical support and insulation, allowing for parallel alignment and efficient manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single type of through connection is used for all interconnection tasks, then the device complexity is reduced, but the adaptability to different frequency and power requirements deteriorates
Solution Approach 1:
The through connections are segmented into two distinct types based on cross-sectional area: first through connections with larger cross-sectional areas for power and ground tasks, and second through connections with smaller cross-sectional areas for high-frequency signal transmission. This segmentation allows each type to be optimized for its specific function, improving adaptability to different frequency and power requirements while maintaining manageable device complexity through systematic classification.
2Power
If through connections with larger cross-sectional area are used for all tasks, then the power transmission capability is improved, but the high-frequency signal transmission performance deteriorates
Solution Approach 1:
Different local qualities (cross-sectional areas) are assigned to different through connections based on their specific functional requirements. First through connections have larger cross-sectional areas localized for high current carrying capacity and power transmission, while second through connections have smaller cross-sectional areas localized for optimal high-frequency signal transmission characteristics. This local differentiation resolves the contradiction by allowing each connection type to excel at its designated task without compromising the other.
3Reliability
If through connections with smaller cross-sectional area are used for all tasks, then the high-frequency signal transmission performance is improved, but the power transmission capability deteriorates
Solution Approach 1:
The solution applies local quality by assigning smaller cross-sectional areas specifically to second through connections that handle high-frequency signals, while first through connections with larger cross-sectional areas handle power transmission. This localized optimization ensures that each connection type performs its designated function effectively, resolving the contradiction between high-frequency performance and power capability.
4Adaptability or versatility
If multiple types of through connections with different cross-sectional areas are implemented, then the versatility for different applications is improved, but the manufacturing complexity increases
Solution Approach 1:
The manufacturing process is segmented into distinct stages: first, through connections are formed during the encapsulation process; second, additional through connections are formed on the exterior surface of the encapsulant. This segmentation of the manufacturing process allows for the creation of multiple through connection types with different cross-sectional areas while managing complexity through a systematic, multi-stage approach rather than attempting to create all variations in a single complex process.
Data Source
AI summary
An electronic device comprising a semiconductor package having a first main surface region and a second main surface region and comprising a semiconductor chip comprising at least one chip pad in the second main surface region and a connector block comprising at least one first electrically conductive through connection and at least one second electrically conductive through connection extending with different cross-sectional areas between the first main surface region and the second main surface region and being arranged side-by-side with the semiconductor chip.