Connector Block for Semiconductor Package Interconnects
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Solution Overview
Problem
Existing packaging techniques for semiconductor devices with multiple elements, such as redistributed chip packages (RCPs), face challenges in efficiently connecting components across the package, particularly when the distance from the top side to the back side is too long for forming and filling vias, making it difficult to establish reliable electrical connections for components like antennas and ground planes.
Innovation Solution
The use of a prefabricated connection block with conductors surrounded by an organic dielectric material, which extends from the top side to the back side, allowing for electrical connections without the need for via holes, and can be formed using wire bonds and ceramic materials for enhanced manufacturing rigidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If via holes are formed to connect components across the package, then electrical connection is established, but the process becomes complex and impractical when the distance is too long
Solution Approach 1:
The patent introduces a connector block as an intermediary component that provides pre-formed electrical pathways through the package. This connector block acts as a mediator between components on the top side and back side, eliminating the need to form long via holes directly through the package substrate. The connector block contains conductive elements embedded in an organic fill material, providing reliable electrical connections without the complexity of long via formation and filling processes.
2Ease of manufacture
If the package distance from top side to back side is reduced, then via formation becomes easier, but the package size and design flexibility are constrained
Solution Approach 1:
The patent divides the electrical connection path into multiple segments: the first segment within the connector block and the second segment within the package substrate. This segmentation allows the connector block to handle the challenging long-distance connection independently, while the package substrate only needs to accommodate shorter connections. This approach maintains package design flexibility and size requirements without compromising via formation feasibility.
3Adaptability or versatility
If multiple elements are integrated into one package, then functionality density increases, but interconnection complexity increases
Solution Approach 1:
The connector block serves as a centralized intermediary that manages interconnections between multiple elements in the package. By providing a dedicated structure with pre-formed conductive pathways, it simplifies the interconnection architecture and reduces the overall complexity of connecting multiple semiconductor devices, antennas, and other components within the same package.
Data Source
AI summary
A packaged semiconductor device includes an interconnect layer over a first side of a polymer layer, a semiconductor device surrounded on at least three sides by the polymer layer and coupled to the interconnect layer, a first conductive element over a second side of the polymer layer, wherein the second side is opposite the first side, and a connector block within the polymer layer. The connector block has at least one electrical path extending from a first surface of the connector block to a second surface of the connector block. The at least one electrical path electrically couples the interconnect layer to the first conductive element. A method of forming the packaged semiconductor device is also described.