Connector Circuit Board Layout With Ground Separation Shielding

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Solution Overview

Problem

Existing connector assemblies struggle to optimize signal conductive areas and ground conductive areas for improved shielding performance.

Innovation Solution

A circuit board and connector assembly design featuring specific arrangements of signal and ground conductive areas, where first and second signal conductive areas are arranged side by side, and first and second ground conductive areas are positioned on either side to separate adjacent signal conductive area groups, enhancing shielding effectiveness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of moving object

If signal conductive areas are arranged closely to increase integration density, then device miniaturization is improved, but shielding performance deteriorates

Engineering Contradiction:
Improveintegration densityVSAvoidshielding performance
Core Design Contradiction:
Area of moving objectVSObject-affected harmful factors

Solution Approach 1:

Ground conductive areas are introduced as intermediary elements between adjacent signal conductive areas. These ground areas act as shielding mediators that intercept electromagnetic interference and provide a reference potential, thereby improving shielding performance without reducing the integration density of signal areas.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The conductive area layout is segmented into distinct functional zones: signal conductive areas for signal transmission and ground conductive areas for shielding. This segmentation allows independent optimization of signal density and shielding effectiveness by strategically distributing ground areas between signal groups.

Inventive Principle:
Principle #1Segmentation

2Object-affected harmful factors

If ground conductive areas are added to improve shielding, then shielding performance is improved, but device complexity increases

Engineering Contradiction:
Improveshielding performanceVSAvoidconductive area configuration
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

Ground conductive areas are strategically placed only in specific locations where shielding is most needed—between adjacent signal conductive areas. This localized approach provides effective shielding while minimizing the overall complexity compared to a complete ground shield.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The ground conductive areas are electrically connected to form a unified shielding network that works collectively to protect signal areas. This merging creates a coordinated shielding system that achieves better performance with simpler individual elements.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS20250113431A1Circuit board and connector assembly with improved shielding performance
Publication Date: 2025.04.03 DONGGUAN LUXSHARE TECH CO LTD
  • US20250113431A1 patent drawing
  • US20250113431A1 patent drawing
  • US20250113431A1 patent drawing

AI summary

A circuit board includes a first signal conductive area, a second signal conductive area, a first ground conductive area and a second ground conductive area. The first signal conductive area and the second signal conductive area both extend along a first direction. The first ground conductive area and the second ground conductive area are located on two sides of the first signal conductive area and the second signal conductive area, respectively, thereby improving shielding effect. A connector assembly including the circuit board is also disclosed.