Connector Module Bracket Layout for Heat Dissipation and Miniaturization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing connector modules face challenges in miniaturization and heat dissipation, particularly with high terminal density, and maintaining effective heat dissipation while ensuring secure fixation and efficient cable-to-board connections.
Innovation Solution
A connector module design featuring a bracket system with a first and second bracket, including receiving grooves and heat dissipation channels, where the circuit board is clamped between the brackets, and a central opening exposes a chip for improved heat dissipation, with conductive terminals engaging directly with the board and cable connectors accommodated in grooves.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If elastic abutting arms are made longer to ensure sufficient elasticity, then reliability is improved, but volume occupied increases
Solution Approach 1:
The abutting arm is configured with a multi-dimensional structure including a horizontal portion and a vertical portion, allowing the elastic deformation to occur in multiple directions. This enables sufficient elasticity while reducing the overall linear length and occupied space of the abutting arm.
2Volume of moving object
If terminal density is increased to reduce connector size, then volume is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The connector shell is divided into multiple segments with heat dissipation channels formed between adjacent segments. This segmentation creates dedicated heat dissipation pathways that are integrated into the connector structure, allowing heat to be efficiently conducted away from the high-density terminals without increasing the overall connector volume.
3Reliability
If circuit board is securely clamped to improve fixation, then reliability is improved, but heat dissipation performance deteriorates
Solution Approach 1:
The clamping structure is designed with selective thermal conductivity - the clamping portions that contact the circuit board are made of materials or structures that provide secure mechanical fixation while maintaining thermal conductivity. Heat dissipation channels are strategically positioned to conduct heat away from the clamped regions, ensuring both reliable fixation and effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat dissipation performance, facilitates secure fixation, reduces occupied space, and ensures reliable electrical connections with high contact density, addressing the challenges of miniaturization and heat management.
Implementation Method 1
the second bracket including a central opening extending through the second bracket along a vertical direction and a plurality of heat dissipation channels extending along horizontal directions
Data Source
AI summary
A connector module includes a bracket and at least one cable connector. The bracket includes a first bracket and a second bracket. The first bracket defines at least one receiving groove. The first bracket includes an opening surrounded by a number of side walls. The second bracket is of a frame-shaped configuration, and includes a central opening extending therethrough along a vertical direction. The cable connector includes a body, a number of conductive terminals and a cable. The body is at least partially received in the receiving groove. The conductive terminals are configured to engage with the conductive elements of a circuit board. The circuit board is at least partially clamped between the first bracket and the second bracket. The circuit board is configured to mount a chip which is exposed in the opening.