Connector Assembly With Bus Bars for Thinner High-Speed PCBs
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Solution Overview
Problem
The increase in the number of layers of a printed circuit board (PCB) for routing high-speed signals leads to increased manufacturing costs and reduced reliability, necessitating a reduction in the total number of layers and board thickness while maintaining signal integrity.
Innovation Solution
A connector assembly that omits the power supply layer by using bus bars connected to power supply pins and pads, allowing these to serve as an alternative power supply layer, reducing the board thickness and improving reliability through flexible routing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of layers of PCB is increased to route high-speed signals, then signal routing capability is improved, but manufacturing cost increases and reliability reduces
Solution Approach 1:
The patent extracts the power supply function from the internal PCB layers and relocates it to external bus bars. This separation allows the PCB to have fewer layers dedicated to signal routing, improving both reliability and manufacturing cost while maintaining the necessary power distribution capability through the external connector assembly.
Solution Approach 2:
The patent transitions power supply from a two-dimensional internal layer structure to a three-dimensional external structure using bus bars that extend perpendicular to the PCB surface. This dimensional change enables power distribution without requiring additional signal layers within the PCB, resolving the contradiction between routing capability and reliability.
2Power
If the number of layers of PCB is increased, then power supply capacity is improved, but board thickness increases
Solution Approach 1:
The power supply capacity function is extracted from the PCB's internal layer structure and transferred to external bus bars. This allows high power supply capacity to be achieved without increasing the number of PCB layers or board thickness, as the power distribution is handled externally by the connector assembly.
3Reliability
If power supply layer is omitted from PCB, then board thickness is reduced and reliability is improved, but power supply connectivity becomes more complex
Solution Approach 1:
The patent merges the power supply pin function with the bus bar structure. The bus bars are directly connected to the power supply pins, creating an integrated power distribution path that simplifies connectivity despite the omission of internal power layers. This integration reduces the need for complex via structures and internal routing.
Solution Approach 2:
The bus bars serve multiple functions: they provide mechanical support, electrical connection, and power distribution. This multi-functionality compensates for the removed power supply layer, maintaining power supply connectivity without requiring additional complex components or structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces manufacturing costs, enhances reliability, and improves flexibility in routing by eliminating the need for power supply layers, while minimizing the connector's external shape and reducing the risk of signal interference.
Implementation Method 1
at least one bus bar, and the bus bar is connected to the one or plurality of power supply pins and is connected to the plurality of pads for power supply
Data Source
AI summary
A connector which is mounted on a circuit board and into which a module board of an external module is inserted in a first direction. The circuit board has pads for power supply that are arranged spaced apart from each other in a second direction, and the module board has electrodes for power supply. The connector includes: a connector body into which the module board is inserted; one or more power supply pins accommodated inside the connector body and being in contact with the electrodes for power supply of the module board; and at least one bus bar. The bus bar is connected to the one or more power supply pins and connected to the pads for power supply that are arranged spaced apart from each other in the second direction.