Connector Assembly Bus Bar Layout for Thinner PCB Power Routing
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Solution Overview
Problem
The increase in the number of layers of a printed circuit board (PCB) for routing high-speed signals leads to increased manufacturing costs and reduced reliability, necessitating a reduction in the total number of layers and board thickness while maintaining signal integrity.
Innovation Solution
A connector assembly that omits the power supply layer from the circuit board by using a bus bar connected to power supply pins and pads arranged orthogonally, allowing the bus bar to serve as an alternative power supply layer, reducing board thickness and improving reliability and flexibility in wiring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of power supply layers is reduced, then manufacturing costs are reduced and reliability is improved, but the flexibility in routing inner layer wirings is reduced
Solution Approach 1:
The patent transitions power supply routing from the inner layers (2D plane) to the outer surface (3D dimension) by using bus bars that extend along the side faces of the connector body. This dimensional change allows power supply paths to be established without occupying inner layer wiring space, thereby maintaining routing flexibility while reducing the number of power supply layers.
Solution Approach 2:
The bus bar acts as an intermediary component that mediates between the power supply pins and the pads on the circuit board. By introducing this intermediate conductor that extends along the side faces, the patent enables power supply routing outside the traditional inner layer structure, thus preserving inner layer flexibility for other signal routing purposes.
2Length of stationary object
If the board thickness is reduced, then manufacturing costs are reduced and reliability is improved, but the space for routing and component placement is reduced
Solution Approach 1:
The patent utilizes the third dimension (side faces of the connector body) for power supply routing instead of consuming vertical space within the board thickness. The bus bars extend along the side faces, effectively moving power supply paths from the z-axis (thickness direction) to the lateral surfaces, thereby reducing board thickness without compromising routing capability.
3Shape
If the connector's external shape is minimized, then the device size is reduced, but the space for bus bar accommodation is reduced
Solution Approach 1:
The bus bars are nested within the connector body structure, with the bus bar accommodation space integrated into the connector's internal volume. The bus bars are positioned to extend along the side faces while being contained within the overall connector envelope, allowing the connector's external shape to remain compact while still accommodating the necessary bus bar structure.
Data Source
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AI summary
Provided is a connector which is mounted on a circuit board 100 and into which a module board of an external module is inserted in a first direction D1. The circuit board 100 has pads for power supply 121Z, 121X that are arranged spaced apart from each other in a second direction D2, and the module board has electrodes for power supply. The connector includes: a connector body into which the module board is inserted; one or more power supply pins 240 accommodated inside the connector body and being in contact with the electrodes for power supply of the module board; and at least one bus bar 220. The bus bar 220 is connected to the one or more power supply pins 240 and connected to the pads for power supply 121Z, 121X that are arranged spaced apart from each other in the second direction D2.