Relay-Substrate Connector Cable for Impedance Matching and Short Prevention
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Solution Overview
Problem
Conventional connector cables experience an increase in impedance and risk of short circuits when the braided shield of a coaxial cable is removed to expose the core wire and intermediate insulator, as they cannot effectively prevent both issues simultaneously.
Innovation Solution
A connector cable design that includes a relay substrate with a ground conductor layer on its front surface, covered with an insulating member, which is positioned directly under the exposed part of the shield member, preventing short circuits and maintaining impedance matching by separating the GND conductor layer from the inner conductor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the braided shield is removed to expose the core wire and intermediate insulator, then the connector cable can be assembled, but impedance increases and short circuit risk arises
Solution Approach 1:
The patent introduces a ground conductor layer on the relay substrate as an intermediary element between the exposed core wire and the connector contact. This ground layer, positioned directly under the exposed dielectric portion, serves as a reference potential that stabilizes impedance while the insulating member covering prevents short circuits. The intermediary ground layer resolves the contradiction by enabling assembly feasibility while maintaining reliability.
Solution Approach 2:
The patent applies local quality by providing the ground conductor layer and insulating member covering specifically under the exposed portion where the braided shield is removed, rather than uniformly across the entire connector cable. This localized treatment addresses the impedance and short circuit issues only where needed, maintaining assembly feasibility while improving reliability at the critical interface region.
2Reliability
If the ground pattern is extended directly under the exposed part, then impedance matching improves, but short circuit with the core wire occurs
Solution Approach 1:
The insulating member covering acts as an intermediary barrier between the ground conductor layer and the core wire. This insulating layer allows the ground pattern to be extended directly under the exposed part for improved impedance matching while preventing harmful short circuits with the core wire, thus resolving the contradiction between impedance matching and short circuit prevention.
Solution Approach 2:
The patent segments the functional layers by separating the ground conductor layer from the core wire through the insulating member covering. This segmentation allows the ground pattern to extend under the exposed part for impedance control while the insulating segment prevents electrical contact with the core wire, eliminating short circuit risk while maintaining impedance matching.
3Ease of operation
If the inner conductor is bent to the front surface of the substrate, then connection is achieved, but manufacturing complexity increases
Solution Approach 1:
Instead of bending the inner conductor up to the front surface of the substrate, the patent inverts the approach by placing the ground conductor layer on the front surface directly under the exposed inner conductor. This inversion eliminates the need for complex bending operations while achieving proper connection and impedance control, reducing manufacturing complexity while maintaining connection capability.
Data Source
AI summary
To prevent both increase in impedance and a short circuit, a connector cable is configured such that a connector and a shielded cable are connected via a relay substrate. The shielded cable includes at least an inner conductor, a dielectric covering the inner conductor, and a shield member covering the dielectric. The inner conductor is connected to a contact of the connector at a part where the shield member and the dielectric are removed to expose the inner conductor. At least directly under a part where the shield member is removed to expose the dielectric, a ground (GND) conductor layer on a front surface of the relay substrate is arranged. The GND conductor layer on the front surface of the relay substrate, which is arranged directly under the part where the shield member is removed, is covered with an insulating member.