Shielded Connector Cage Layout for Heat, EMI, and Wafer Alignment
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Solution Overview
Problem
High-speed data connector assemblies face challenges in controlling temperature, maintaining conductor alignment, and reducing electromagnetic interference (EMI) within receptacle cages.
Innovation Solution
The development of compact, high-speed multi-level, multi-port connector assemblies with a shielded cage, internal housing made of high-temperature Liquid Crystal Polymer (LCP), and alignment features such as supporting side plates and tail alignment structures, along with conductive ground shields and dual ground paths to manage temperature and EMI.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If electronic circuits are integrated into plug modules for high-speed data transmission, then data transmission speed is improved, but temperature control becomes more difficult
Solution Approach 1:
The connector assembly is divided into multiple independent receptacle cages, each housing separate electronic circuits and wafer assemblies. This segmentation allows independent thermal management of each cage, preventing heat accumulation from affecting the entire assembly and enabling high-speed data transmission across multiple ports simultaneously.
Solution Approach 2:
The patent employs a nested structure where wafer assemblies are housed within receptacle cages, which are in turn housed within the main connector housing. The internal housing composed of high-temperature LCP material provides thermal insulation for the nested wafer assemblies, allowing them to operate at high speeds while maintaining temperature control through the hierarchical nesting arrangement.
2Volume of moving object
If multiple wafers are integrated into a compact assembly, then device compactness is improved, but alignment precision of conductors deteriorates
Solution Approach 1:
The side plates are pre-configured with precisely positioned apertures and tail alignment structures before wafer installation. The wafer assemblies are designed with protrusions that correspond to these pre-positioned features, ensuring that when the wafers are inserted into the compact receptacle cages, their conductors are automatically aligned with the required precision despite the compact multi-wafer configuration.
Solution Approach 2:
The side plates act as intermediary structures between the multiple wafers and the external connection points. These side plates provide a stable reference framework with precisely positioned apertures that mediate the alignment of conductor tails from multiple compactly arranged wafers, ensuring accurate electrical connections while maintaining assembly compactness.
3Object-affected harmful factors
If shielded cage structure is implemented to reduce EMI, then electromagnetic interference reduction is improved, but device complexity increases
Solution Approach 1:
The shielded cage structure serves multiple functions simultaneously: it provides electromagnetic shielding to reduce EMI, acts as a mechanical support framework for the receptacle assemblies, and provides structural rigidity to maintain alignment precision. This multi-functionality reduces overall device complexity by consolidating what would otherwise require separate components into a single integrated shielded cage structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively controls temperature and maintains alignment of conductors while reducing EMI, enabling reliable high-speed data transmission up to at least 100 Gigabits per second.
Implementation Method 1
the plastic may comprise a high-temperature Liquid Crystal Polymer (LCP)
Implementation Method 2
a shielded cage; and a connector within the cage comprising... conductive ground shields and dual ground paths to manage temperature and EMI
Data Source
AI summary
High-speed connectors and connector assemblies that include structures for alignment and/or improved thermal performance. In one example, a connector assembly, comprising: a housing comprising a port; a wafer assembly with contacts positioned in the port of the housing, the wafer assembly comprising a row of conductors, the row of conductors comprising a plurality of communication signal conductors and a plurality of ground conductors arranged in the row of conductors, wherein each communication signal conductor is positioned next to a ground conductor among the plurality of ground conductors in the row of conductors; and a ground path assembly comprising the plurality of ground conductors, a conductive ground shield, and a metal ground shield insert that is stitch mated with the conductive ground shield.