Electrical Connector Carrier Buckling Portion Alignment

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Solution Overview

Problem

The existing electrical connectors for chip modules often require manual assembly, leading to potential misalignment between the chip module and conducting terminals, which affects the quality of the electrical connection.

Innovation Solution

An electrical connector design that includes a carrier with a buckling portion for accurately positioning the chip module, featuring a first gap larger than the second gap between side walls and terminals, allowing for simple and precise assembly by preventing damage to terminals and enhancing the buckling force.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If manual assembly is used to place the chip module onto the insulating body, then the assembly process is simple, but alignment accuracy between the chip module and conducting terminals deteriorates

Engineering Contradiction:
Improveassembly simplicityVSAvoidalignment accuracy
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The patent introduces a carrier as an intermediary component between the operator and the chip module. The carrier includes a buckling portion that engages with the chip module, enabling precise positioning and transfer to the insulating body. This intermediary structure eliminates direct manual handling of the chip module, ensuring accurate alignment with conducting terminals while maintaining operational simplicity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If the gap between side wall and peripheral terminal is reduced for better positioning, then positioning accuracy improves, but the risk of terminal damage during assembly increases

Engineering Contradiction:
Improvepositioning accuracyVSAvoidterminal damage risk
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent applies different gap dimensions at different locations: a first gap between the first side wall and its corresponding peripheral terminal, and a second gap between the second side wall and its corresponding peripheral terminal. The first gap is configured to be larger than the second gap, allowing the buckling portion to be received in the first gap without damaging terminals, while the smaller second gap provides sufficient positioning accuracy for proper alignment.

Inventive Principle:
Principle #3Local quality

3Manufacturing precision

If a carrier with buckling portion is introduced for precise positioning, then assembly precision improves, but device complexity increases

Engineering Contradiction:
Improveassembly precisionVSAvoidstructure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent segments the positioning function into distinct components: the insulating body with side walls and gaps, and the carrier with a specifically shaped buckling portion. This segmentation allows each component to be optimized independently for its specific function while working together to achieve precise assembly, without requiring complex integrated structures.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS9577357B2Electrical connector with a carrier and terminals located at different distances from side walls
Publication Date: 2017.02.21 LOTES
  • US9577357B2 patent drawing
  • US9577357B2 patent drawing
  • US9577357B2 patent drawing

AI summary

An electrical connector for electrically connecting with a chip module includes an insulating body having a bottom wall, multiple rows of terminals located in the bottom wall for electrically connecting the chip module, and a carrier for carrying the chip module to the insulating body. Two first side walls extend from two opposite sides of the bottom wall upward, and two second side walls extend from the other two opposite sides of the bottom wall upward. There are a first gap between the first side wall and a most peripheral terminal corresponding to the first side wall, and a second gap between the second side wall and a most peripheral terminal corresponding to the second side wall. The first gap is greater than the second gap. The carrier has a buckling portion, received in the first gap, and for buckling a bottom surface of the chip module.