Electrical Connector Compensation Segments Mitigate Air Pocket Impedance

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Solution Overview

Problem

Conventional electrical connectors experience performance issues due to air pockets formed during the overmolding process, which increase impedance and affect signal strength and electromagnetic fields.

Innovation Solution

The electrical connector design includes a lead frame overmolded with a dielectric frame that has voids exposing compensation segments with a different geometry than the intermediate segments, which compensate for the air pockets by reducing impedance and improving signal transmission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If pinch pins are used to retain the lead frame during overmolding, then the lead frame is held in place properly, but air pockets are formed along the contacts

Engineering Contradiction:
Improvelead frame positioningVSAvoidair pockets
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent converts the harmful air pockets into beneficial compensation segments. The voids created by removing pinch pins are intentionally designed to expose specific portions of the contacts, creating compensation segments that offset the impedance changes caused by the air pockets. This transforms a manufacturing defect into a functional feature that maintains impedance control.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent changes the geometric parameters of the contact portions exposed through voids. By controlling the size, shape, and location of voids in the dielectric frame, the patent creates compensation segments with specific geometries that alter the electromagnetic field distribution and compensate for impedance variations caused by air pockets.

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If air pockets are present along the contacts, then the overmolding process is simpler, but the impedance of the contact increases

Engineering Contradiction:
Improveovermolding processVSAvoidimpedance control
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent segments the contact structure into different portions: intermediate segments encased in dielectric material and compensation segments exposed through voids. This segmentation allows different portions of the contact to serve different functions - the intermediate segments provide structural support while the compensation segments control impedance by being exposed to air, thus maintaining overall impedance control despite the presence of air pockets.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies local quality by creating voids at specific locations along the contacts where compensation is needed. Not the entire contact is exposed to air, but only specific compensation segments are exposed through strategically placed voids, while other portions remain encased in dielectric material. This localized approach maintains impedance control without requiring complete removal of dielectric material.

Inventive Principle:
Principle #3Local quality

3Quantity of substance

If air pockets are present, then material usage is reduced, but signal speed and strength are reduced

Engineering Contradiction:
Improvedielectric materialVSAvoidsignal speed
Core Design Contradiction:
Quantity of substanceVSSpeed

Solution Approach 1:

The patent applies partial action by creating voids that expose only the necessary compensation segments rather than removing dielectric material along the entire length of the contacts. This partial exposure provides sufficient impedance compensation and signal speed improvement while minimizing the quantity of dielectric material removed, thus balancing material reduction with performance maintenance.

Inventive Principle:
Principle #16Partial or excessive action

4Productivity

If air pockets are present, then the overmolding process is faster, but electromagnetic field between contact and shield is altered

Engineering Contradiction:
Improveovermolding cycle timeVSAvoidelectromagnetic field integrity
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent converts the harmful electromagnetic field alterations caused by air pockets into beneficial effects. The voids create compensation segments that intentionally alter the electromagnetic field in a controlled manner to compensate for the presence of air pockets, thereby maintaining field integrity and signal quality despite the simplified overmolding process.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The compensation segments effectively mitigate the impact of air pockets, maintaining target impedance and enhancing signal speed and electromagnetic field integrity.

Implementation Method 1

The air pockets have different dielectric properties in comparison to the overmolding material. The compensation segments are exposed by the voids and have a geometry that differs from intermediate segments to compensate for the air pockets

Methodology Applied
Scientific EffectDielectric property difference: Dielectric

Data Source

PatentEP2707927B1Electrical connector having compensation segments for air pockets
Publication Date: 2017.07.19 TE CONNECTIVITY CORP
  • EP2707927B1 patent drawingFigure 1
  • EP2707927B1 patent drawingFigure 2
  • EP2707927B1 patent drawingFigure 3~4

AI summary

An electrical connector comprises a contact module having a lead frame (144) and a dielectric frame encasing the lead frame. The dielectric frame has opposite sides a mating edge and a mounting edge. The lead frame comprises a plurality of contacts (108) having transition portions (164) that extend between mating portions (158) extending from the mating edge and mounting portions (160) extending from the mounting edge. The dielectric frame has voids in the sides which are open to the lead frame. The transition portions (164) have compensation segments (192) and intermediate segments (194) between the compensation segments. The intermediate segments are encased in the dielectric frame, and the compensation segments are exposed by the voids. The compensation segments have a geometry that differs from a geometry of the intermediate segments.