High Frequency Connector Component Protecting Member

The invention divides the circuit board area into two distinct zones: a first area without components where wires are routed, and a second area with high frequency electronic components. This segmentation prevents wires from crossing over sensitive components, eliminating the need for insulation glue while maintaining signal integrity. The circuit board is effectively partitioned to separate signal transmission paths from component mounting areas.

The patent introduces an intermediary structure (the first area without electronic components) that serves as a dedicated wire routing zone. This intermediary space acts as a buffer between the wires and the high frequency components, allowing flexible wire routing without direct contact or proximity to sensitive components, thus avoiding dielectric loss issues.

The circuit board is segmented into a first area for wire routing (without components) and a second area for high frequency electronic components. This spatial segmentation allows the wires to be routed flexibly in the first area without needing to cross over components in the second area, eliminating the requirement for insulation glue and preventing associated dielectric losses.

The patent applies local quality by creating a specific zone (first area) with different functional properties - it is designated as a component-free zone optimized for wire routing. This local area has the quality of being free from electronic components, allowing wires to pass through without exposure to dielectric materials, while the rest of the board maintains normal component distribution.