High-Speed Connector Grounding With Deformable Conductive Buffers

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Solution Overview

Problem

Conventional high-speed connectors face issues with insertion loss, crosstalk, and vibration-induced electrical discontinuity due to manufacturing tolerances and the use of slender cantilever beams, which result in inadequate normal force and point or line contact interfaces, leading to insertion difficulties and electrical instability.

Innovation Solution

A high-speed connector design featuring an insulating case with terminal slots and an accommodating slot, including swingable terminals and conductive buffers that transform from an initial to a deformation state to establish a surface contact with grounding terminals, providing a resilient connection and improved vibration resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If conventional slender cantilever beams are used as elastic arms, then the device complexity is reduced, but the reliability deteriorates due to vibration-induced electrical discontinuity and point contact separation

Engineering Contradiction:
Improvestructure complexityVSAvoidelectrical connection stability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent replaces slender cantilever beams with flexible conductive buffers made of elastic material. These buffers deform elastically under compression to maintain continuous surface contact with grounding terminals, preventing electrical discontinuity during vibration while absorbing mechanical shocks. The flexible buffer acts as a compliant element that adapts to manufacturing tolerances and maintains reliable electrical connection.

Inventive Principle:
Principle #30Flexible shells and thin films

2Ease of manufacture

If conventional stamping method is used to form elastic arms, then the ease of manufacture is improved, but the manufacturing precision deteriorates due to accumulation of tolerances affecting normal force distribution

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoidnormal force control precision
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent changes the physical state and mechanical properties of the conductive buffer by selecting materials with specific elastic moduli and damping characteristics. The buffer is designed with optimized geometric parameters (length, width, thickness) to control its deformation behavior. This allows the system to accommodate a wide distribution of compression deformations while maintaining adequate normal force and electrical connection, resolving the tolerance accumulation issue.

Inventive Principle:
Principle #35Parameter changes

3Device complexity

If point or line contact interface is used between elastic arms and grounding terminals, then the device complexity is reduced, but the reliability worsens due to contact separation under shock or vibration

Engineering Contradiction:
Improvecontact interface complexityVSAvoidcontact interface stability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent transitions from zero-dimensional point contact or one-dimensional line contact to two-dimensional surface contact between the conductive buffer and grounding terminals. The buffer's broad contact surface ensures continuous electrical connection during vibration and shock by distributing contact pressure and maintaining engagement through elastic deformation, eliminating contact separation issues.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Ease of manufacture

If conventional grounding sheet with uniform elastic arms is used, then the ease of manufacture is improved, but the adaptability deteriorates due to inability to satisfy different functional demands across wide distribution of deformations

Engineering Contradiction:
Improvegrounding sheet uniformityVSAvoiddeformation range adaptability
Core Design Contradiction:
Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent applies local quality by allowing different conductive buffers to have different geometric dimensions and material properties tailored to their specific positions and functional requirements. Each buffer can be optimized for its local deformation characteristics, enabling the grounding system to adapt to a wide distribution of compression deformations while maintaining adequate normal force and electrical connection across all contact points.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The connector effectively addresses the wide distribution of compression deformations, ensuring adequate normal force and electrical connection, while enhancing vibration and impact resistance through a surface contact interface, differing from conventional cantilever-based designs.

Implementation Method 1

each one of the conductive buffers is a resilient construction and is configured to transform from an initial state to a deformation state by pressing

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Implementation Method 2

The deformation of each elastic arm is relative to the compression stroke of the grounding terminal. The values of the deformations of the elastic arms can be summarized in a wide distribution because of accumulation of manufacturing tolerances

Methodology Applied
Scientific EffectNormal force: Mechanical Force

Data Source

PatentUS9577370B2High-speed connector with electrical ground bridge
Publication Date: 2017.02.21 GREENCONN
  • US9577370B2 patent drawing
  • US9577370B2 patent drawing
  • US9577370B2 patent drawing

AI summary

A high-speed electrical connector includes an insulating case, several signal terminals, several grounding terminals, an electrical bridge, and several resilient conductive buffers mounted in the insulating case. Each of the signal and grounding terminals has a fixing segment and a swing segment swingable with respect to the fixing segment. The electrical bridge corresponds to two of the grounding terminals. The conductive buffers are disposed on the electrical bridge and are respectively arranged in the swing paths of the swing segments. Each conductive buffer is configured to transform from an initial state to a deformation state by pressing. Each swing segment can swing to press the corresponding conductive buffer, causing the corresponding conductive buffer to be in the deformation state, thereby establishing an electrical connection path between the electrical bridge and the corresponding grounding terminals. In one example, the buffer can be formed of elastomer mixed with conductive particles.