Connector Assembly Coplanar Back Surface Overmolding

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Solution Overview

Problem

Conventional connectors for electrical cables often result in an extended overmolded portion that increases the height when mated, causing the cables to be pushed together at the back surface, which can lead to inefficiencies and additional complexity.

Innovation Solution

An insulative housing is overmolded onto the termination section of a circuit board, with a spacer fixture maintaining the spacing between cables, ensuring the back surface of the housing is coplanar with the circuit board, preventing cable compression and simplifying the mating process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the insulative housing is overmolded onto the cable end without cable spacing, then the manufacturing process is simplified, but the cables are compressed together at the back surface causing height increase and mating inefficiency

Engineering Contradiction:
Improveovermolding process simplicityVSAvoidmating efficiency
Core Design Contradiction:
Ease of manufactureVSEase of operation

Solution Approach 1:

The cables are pre-positioned and spaced apart at the back surface of the insulative housing before the overmolding process is completed. This preliminary spacing action prevents cable compression during mating while allowing the overmolding to proceed without complex tooling modifications.

Inventive Principle:
Principle #10Preliminary action

2Device complexity

If the overmolded portion extends beyond the circuit board back surface, then the connector structure is simplified, but the height increases and cables are pushed together causing complexity

Engineering Contradiction:
Improveconnector structure simplicityVSAvoidconnector height
Core Design Contradiction:
Device complexityVSLength of stationary object

Solution Approach 1:

The insulative housing is designed with different local qualities: the front portion extending beyond the circuit board provides structural support and cable positioning, while the back surface is finished coplanar with the circuit board to prevent cable compression. This localized differentiation resolves the contradiction between structural simplicity and height control.

Inventive Principle:
Principle #3Local quality

3Ease of manufacture

If the back surface of the housing is not coplanar with the circuit board, then the overmolding process is simpler, but cable compression occurs leading to additional complexity

Engineering Contradiction:
Improveovermolding process simplicityVSAvoidcable spacing requirements
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The insulative housing itself serves the dual function of providing structural support and maintaining cable spacing through its coplanar back surface design. The housing structure automatically prevents cable compression without requiring external spacing mechanisms, making the system self-sufficient and eliminating additional complexity.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS10535939B1Connector assembly
Publication Date: 2020.01.14 3M INNOVATIVE PROPERTIES CO
  • US10535939B1 patent drawing
  • US10535939B1 patent drawing
  • US10535939B1 patent drawing

AI summary

A connector assembly including a connector and first and second cables is described. The connector includes an insulative housing and a circuit board partially disposed in the housing. The circuit board includes a mating section and a termination section. The mating section includes a plurality of first contact pads and the termination section includes a plurality of second contact pads electrically connected to the first contact pads. The first and second cables include conductors having front ends terminated at the second contact pads. The housing is overmolded onto and encapsulates at least the front ends of the conductors and the termination section of the circuit board. The circuit board includes a back surface at a rear end of the circuit board and the housing includes a back surface at a cable end of the housing which may be substantially coplanar with the back surface of the circuit board.