PCB Connector Fixing Bracket for Stable Soldered Through-Hole Fit
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Solution Overview
Problem
Existing connectors with snap-fit terminals face issues with uneven gaps between the leg portion and the through hole in the circuit board, leading to inadequate solder fixation and potential position shifts during assembly.
Innovation Solution
The connector design incorporates a fixing bracket with a deflecting portion and a retaining portion that are resiliently deformable and project into the through hole, along with a second bracket with a larger creepage surface, to ensure proper alignment and fixation by solder.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the width of the through hole is set to be larger than the width of the leg portion to allow the locking portion to pass through, then the leg portion can be inserted into the through hole, but a large uneven gap is formed between the leg portion and the inner surface of the through hole
Solution Approach 1:
The invention applies local quality by providing a filler structure that specifically fills the gap between the leg portion and the inner surface of the through hole. The filler is positioned locally at the gap region rather than uniformly across the entire structure, targeting the specific area where the gap exists to improve solder flow while maintaining the original through hole dimensions for insertability.
2Ease of operation
If a large gap is formed between the leg portion and the inner surface of the through hole, then the locking portion can pass through easily, but the solder hardly flows into the gap and cannot evenly coat the snap-fit terminal
Solution Approach 1:
The filler acts as an intermediary element between the leg portion and the solder. It provides a bridge that guides and facilitates solder flow into the gap region, enabling the solder to reach areas that would otherwise be inaccessible due to the large gap, thereby improving solder fixation quality without compromising passability.
3Ease of operation
If a large gap is formed between the leg portion and the inner surface of the through hole, then insertion is facilitated, but the snap-fit terminal may shift in the width direction and position cannot be determined
Solution Approach 1:
The filler is pre-positioned in the through hole before the leg portion is inserted. This preliminary action creates a predetermined structure that guides the leg portion into the correct position, preventing lateral shifting during insertion and ensuring accurate positioning of the snap-fit terminal on the printed board.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for satisfactory solder fixation and suppresses position shifts with respect to the circuit board, ensuring reliable connectivity and stability.
Implementation Method 1
a deflecting portion resiliently deformable in a width direction of the through-hole, the deflecting portion being inserted into the through-hole
Data Source
AI summary
A fixing portion includes a first inserting portion and a second inserting portion. The first inserting portion includes a deflecting portion resiliently deformable in a width direction of the through-hole and to be inserted into the through-hole and a retaining portion projecting in the width direction from the deflecting portion on a tip part of the deflecting portion and configured to suppress the deflecting portion from coming out from the through-hole. The second inserting portion is arranged side by side with the first inserting portion in a depth direction orthogonal to the width direction in the through-hole. A second creepage surface along an inner peripheral edge of the through-hole, out of the second inserting portion, is larger than a first creepage surface along the inner peripheral edge of the through-hole, out of the first inserting portion.