Connector Floating Structure for High-Density CPU Mounting

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Solution Overview

Problem

Existing information processing apparatuses face challenges in achieving high-density CPU mounting due to limitations in guide rail accuracy and manual connection of cables and couplers, which hinder efficient maintenance and increase in processing speed.

Innovation Solution

The design incorporates a substrate with strategically arranged connectors and a metal plate with increased clearance between connectors, allowing for self-fitting and floating structures that absorb positional deviations, enabling high-density mounting and reducing the need for manual access spaces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If guide rail accuracy is increased to achieve precise connector fitting, then manufacturing complexity and cost increase, but fitting precision is improved

Engineering Contradiction:
Improveconnector fitting precisionVSAvoidguide rail accuracy requirement
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The connector is designed with self-fitting capability through asymmetric structure and guide pins that automatically align and position the connector during insertion, eliminating the need for high-precision guide rails. The connector itself performs the positioning function that would otherwise require precision manufacturing of the guide rail system.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

Guide pins are introduced as intermediary elements between the guide rail and the connector. These guide pins provide the necessary alignment and positioning guidance, allowing the use of lower-precision guide rails while still achieving accurate connector fitting. The guide pins act as a mediator that compensates for the reduced precision of the guide rail system.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of operation

If manual connection of cables and couplers is required, then ease of operation is improved for maintenance, but device complexity and maintenance time increase

Engineering Contradiction:
Improvemaintenance accessibilityVSAvoidconnection structure
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The cable connection structure is merged with the connector assembly, integrating the cable routing and connection functions into the same structural unit. This integration eliminates separate manual connection steps for cables and connectors, reducing overall device complexity while maintaining ease of maintenance through the unified removable module design.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The connector assembly is designed as a universal module that handles multiple functions including electrical connection, cable routing, and mechanical positioning. This multi-functional design reduces the number of separate components and manual operations required, simplifying the overall system while maintaining operational ease.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Productivity

If CPU density is increased in limited area, then productivity is improved, but heat generation increases requiring more efficient cooling

Engineering Contradiction:
Improveprocessing speedVSAvoidCPU temperature
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The cooling system is segmented into modular cooling units that can be independently configured and positioned. Each cooling unit targets specific high-heat-generation areas, allowing efficient heat dissipation from densely packed CPUs. The segmentation enables scalable cooling capacity that matches the CPU density configuration.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS10362704B2Information processing apparatus
Publication Date: 2019.07.23 FUJITSU LTD
  • US10362704B2 patent drawing
  • US10362704B2 patent drawing
  • US10362704B2 patent drawing

AI summary

An information processing apparatus includes a substrate that includes a first connector and a second connector, a backplane that includes a third connector coupled to the first connector and a fourth connector coupled to the second connector, and a metal plate attached to the backplane, wherein the metal plate has an opening to which the fourth connector is attached, wherein the first connector is arranged near a central part of the substrate on an end side inserted into the backplane and the second connector is arranged on each side of the first connector, and wherein a clearance between the opening of the metal plate and the fourth connector increases as a distance from the third connector to the fourth connector increases.