Connector Assembly with Gearbox IC for Data Rate Conversion

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Solution Overview

Problem

Existing optical communications networks face challenges in increasing bandwidth without duplicating or redesigning optical transceiver modules and ASICs, which are costly solutions.

Innovation Solution

A connector assembly with a gearbox IC is used to interconnect parallel optical transceiver modules with a system circuit board, enabling data rate conversion without requiring redesign of existing ASICs, allowing for increased bandwidth by doubling the data rate of optical fiber links.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If optical transceiver modules and ASICs are duplicated to increase bandwidth, then data rate increases, but cost increases significantly

Engineering Contradiction:
Improvedata rateVSAvoidcost
Core Design Contradiction:
ProductivityVSEase of manufacture

Solution Approach 1:

A gearbox IC is introduced as an intermediary component between the existing ASIC and the optical transceiver module. The gearbox IC performs data rate conversion by receiving data at a lower rate from the ASIC and converting it to a higher rate for the optical transceiver, enabling bandwidth increase without duplicating expensive ASICs or transceiver modules

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention changes the data rate parameter by using a gearbox IC that can operate at multiple data rates. The gearbox IC receives data at a first data rate from the ASIC and converts it to a second, higher data rate for the optical transceiver module, allowing the system to achieve higher bandwidth without hardware duplication

Inventive Principle:
Principle #35Parameter changes

2Productivity

If optical transceiver modules and ASICs are redesigned to increase bandwidth, then data rate increases, but development cost and time increase

Engineering Contradiction:
Improvedata rateVSAvoidredesign time
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The gearbox IC serves as a mediator that enables higher data rates without requiring redesign of the existing ASIC or optical transceiver module. The gearbox IC handles the data rate conversion function, allowing the system to achieve 25 Gbps or higher without modifying the proven ASIC design

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The gearbox IC is pre-designed and ready to interface with existing ASICs and optical transceiver modules. By using a pre-developed data rate conversion component, the system can quickly achieve higher data rates without undergoing time-consuming redesign cycles

Inventive Principle:
Principle #10Preliminary action

3Adaptability or versatility

If electrical interconnections are lengthened to connect more components, then system functionality increases, but signal integrity deteriorates

Engineering Contradiction:
Improvesystem functionalityVSAvoidsignal integrity
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The data rate conversion function is extracted from the ASIC and placed in a separate gearbox IC. This allows the ASIC to maintain its original design with shorter electrical interconnections, while the gearbox IC handles the high-speed data rate conversion with its own optimized, shorter connections to the optical transceiver module

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The system is segmented into distinct functional blocks: the ASIC, the gearbox IC, and the optical transceiver module. Each block has its own optimized electrical interconnections, allowing high-speed signals to travel shorter distances within each segment while maintaining overall system functionality

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively doubles the data rate of optical fiber links without the need for redesigning ASICs, reducing costs and maintaining high signal integrity by keeping electrical connections short and reducing routing requirements on the system circuit board.

Implementation Method 1

at least one gearbox IC for performing data rate conversion mounted on the assembly circuit board

Methodology Applied
Scientific EffectData rate conversion:

Implementation Method 2

each ASIC communicates electrical data signals to its respective optical transceiver module, which then converts the electrical data signals into respective optical data signals for transmission over the optical fibers

Methodology Applied
Scientific EffectElectro-optic conversion: Electro-Optic Effects

Implementation Method 3

the optical transceiver module receives optical data signals coupled into the module from respective optical fibers and converts the respective optical data signals into respective electrical data signals

Methodology Applied
Scientific EffectOpto-electric conversion: Photoelectric Effect

Data Source

PatentUS9052484B2Connector assembly, a system and method for interconnecting one or more parallel optical transceiver modules with a system circuit board
Publication Date: 2015.06.09 AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE LTD
  • US9052484B2 patent drawing
  • US9052484B2 patent drawing
  • US9052484B2 patent drawing

AI summary

A connector assembly is provided that mates on one side with an optical transceiver module holder and that electrically connects on the opposite side with an external system circuit board. When the connector assembly is mated with an optical transceiver module holder, a base of a parallel optical transceiver module held in the holder mates with a socket of the connector assembly such that respective arrays of electrical contacts disposed on the base and in the socket come into contact with one another. At least one gearbox IC for performing data rate conversion is mounted on the assembly circuit board. A lower surface of the assembly circuit board has an array of electrical contacts on it that are in contact with an array of electrical contacts disposed on the surface of the external system circuit board on which the connector assembly is mounted.