Connector Ground Layer Layout for High-Speed Signal Integrity
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Solution Overview
Problem
Existing electronic device connectors, such as USB type-C connectors, face challenges in maintaining signal integrity and noise reduction due to the lack of a stable ground path and impedance asymmetry, which affects high-speed data transmission and noise shielding.
Innovation Solution
The electronic device incorporates a connector design with a ground layer disposed between two pin layers, maintaining a constant distance and connected through vias, and featuring a mesh ground configuration to enhance signal performance and noise reduction, replacing the traditional mid-plate function.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a traditional connector design without a dedicated ground layer is used, then the device complexity is reduced, but signal integrity and noise shielding deteriorate
Solution Approach 1:
The connector is segmented into distinct functional layers: a first pin layer for data signals, a dedicated ground layer for reference potential and shielding, and a second pin layer for additional signals. This segmentation allows each layer to perform its specific function optimally, with the ground layer providing stable reference potential and noise shielding for the signal layers.
Solution Approach 2:
The ground layer acts as an intermediary between the first and second pin layers, providing a stable reference potential that shields the signal paths from electromagnetic interference. This intermediate ground layer mediates the electromagnetic environment, reducing crosstalk and noise between adjacent signal traces.
2Manufacturing precision
If the ground layer distance from pin layers varies, then manufacturing precision is improved, but impedance asymmetry increases affecting high-speed data transmission
Solution Approach 1:
The patent maintains the ground layer at a substantially constant distance from both the first and second pin layers, establishing a fixed geometric parameter that ensures symmetric impedance characteristics. This constant distance parameter is critical for maintaining balanced differential signal paths and preventing impedance mismatches that would degrade high-speed data transmission.
3Reliability
If ground pins are not connected through vias, then device complexity is reduced, but ground path stability and noise reduction deteriorate
Solution Approach 1:
Multiple ground pins from the first and second pin layers are merged into a unified ground system through via connections to the dedicated ground layer. This merging creates a low-impedance ground path that effectively shields the signal paths and provides a stable reference potential across the entire connector structure.
4Temperature
If heat dissipation structures are not integrated, then device complexity is reduced, but thermal management performance deteriorates
Solution Approach 1:
The ground layer serves multiple functions simultaneously: it provides electromagnetic shielding, establishes a stable reference potential for signal integrity, and acts as a thermal management pathway for heat dissipation. This multi-functionality reduces the need for separate dedicated structures for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design strengthens the ground connection, minimizes noise emission, and dissipates heat, thereby improving signal integrity and shielding performance for high-speed data transmission in electronic devices.
Implementation Method 1
a ground layer disposed between the first layer and the second layer and disposed to maintain a substantially constant distance from the first layer and the second layer
Implementation Method 2
The first ground pin and the second ground pin may be configured to be connected through at least one via
Implementation Method 3
The ground layer may include a mesh ground in which at least some of ground electrodes constituting the ground layer are disposed in a mesh form
Data Source
AI summary
An electronic device includes a housing and a connector disposed in the housing. The connector includes a case forming an outer surface of the connector and having an opening formed in at least a portion of the outer surface and a printed circuit board disposed in the case and including a first layer where a plurality of first pins are disposed, a second layer where a plurality of second pins are disposed, and a ground layer disposed between the first layer and the second layer and disposed to maintain a substantially constant distance from the first layer and the second layer. The plurality of first pins includes at least one first ground pin. The plurality of second pins includes at least one second ground pin. The first ground pin and the second ground pin are configured to be connected through at least one via.