Connector Ground Layout for Common-Mode Noise Shielding
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Solution Overview
Problem
Conventional electronic devices face challenges in effectively reducing common mode noise leakage and preventing external noise interference, particularly in configurations where current division ratios are not fixed, leading to increased costs and instability in ground layers, especially in inverter circuits with large current switching.
Innovation Solution
The electronic device design features a substrate with a main circuit pattern and a frame ground pattern that do not overlap, with a connector terminal in the frame ground pattern, creating sparse electrostatic coupling to reduce noise leakage, and incorporates a noise filter connected to the frame ground pattern to enhance shielding effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the main circuit pattern and frame ground pattern are separated to reduce electrostatic coupling and noise leakage, then electromagnetic compatibility is improved, but device complexity increases due to additional design constraints
Solution Approach 1:
The substrate pattern is segmented into distinct main circuit pattern portions and frame ground pattern portions that are spatially separated and do not overlap. This segmentation reduces electrostatic coupling between signal circuits and ground, thereby reducing common mode noise leakage while maintaining functional integrity
Solution Approach 2:
The connector terminal is specifically positioned within the frame ground pattern portion rather than in main circuit areas. This local placement strategy ensures that connector signals are referenced to a stable ground potential, reducing noise coupling at the interface with external systems
2Object-affected harmful factors
If a shield pattern is connected to a ground layer to enhance shielding effect, then noise transmission is reduced, but the ground layer becomes unstable and may become a noise source in inverter circuits
Solution Approach 1:
The frame ground pattern is extracted as a separate functional element distinct from the main ground layer used by inverter circuits. By positioning connector terminals in the frame ground pattern portion and separating it from main circuit areas, the patent creates a dedicated ground reference for external interfaces that does not share current paths with high-current switching circuits, thereby preventing ground layer instability and noise generation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces common mode noise leakage and prevents external noise interference by minimizing electrostatic coupling and enhancing the noise filter's performance, thereby improving electromagnetic compatibility (EMC) at a lower cost.
Implementation Method 1
electrostatic coupling between the main circuit pattern portion and the frame ground pattern portion is made sparse, thereby reducing leakage of a common mode noise generated in the main circuit to outside through the electrostatic coupling
Data Source
AI summary
The electronic device includes: a substrate having an electronic circuit formed therein; a housing for housing the substrate; and a connector disposed on the substrate and serving as an interface between outside and inside of the housing. The substrate has a main circuit pattern portion that forms a main circuit and a frame ground pattern portion that forms a frame ground. The main circuit pattern portion and the frame ground pattern portion are disposed so as not to overlap each other on the substrate and in the substrate. A terminal of the connector is disposed in the frame ground pattern portion.